Advanced UV Laser Cutter for High-Precision OLED Film Manufacturing

Name: Advanced UV Laser Cutter for High-Precision OLED Film Manufacturing
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2119029932

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-70,000.00

1 Piece

Sample price:US$55000.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

7*24 Hours

Warranty

12 Months

Model NO.

PUL-01

Application

Automotive Industry, Semiconductor

Cooling System

Water Cooling

Technical Class

Pulse Laser

Applicable Material

Nonmetal

Structure Type

Gantry Type

Laser Classification

Semiconductor Laser

Laser Technology

Laser Control Fault Cutting

Laser Power

10W, 15W, 20W, 30W

Processing Area

600*500mm

Laser Wavelength

355nm

Galvo Scanning Range

50*50mm

Output Pulse Width

≤15PS

Cutting Line Width

Less Than 20um

Comprehensive Processing Precision

±30um

Repeat Precision

X/Y: ±1um

Positioning Precision

X/Y: ±3um

Power Requirement

380V/50 - 60Hz

Transport Package

Wooden Pack

Specification

1770*1670*1860mm

Trademark

Himalaya

Origin

China

Production Capacity

100

Key features

Cold Ablation UV Picosecond Laser

Advanced CCD Vision Positioning

High-Speed Galvo Scanner + F-Theta Lens

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤3.13h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How many traditional processes does this system replace?

This single platform integrates and replaces four distinct traditional processes: FPC auxiliary material blanking, Drilling, Shaping, Punching

Q:What materials can this system process?

FPC (Flexible Printed Circuits), auxiliary materials, thin films, and other heat-sensitive

Q:What is the advantage of a UV picosecond laser over other laser types?

The UV wavelength is absorbed more efficiently by many materials, while the picosecond pulse duration is so short that it ablates the material before heat can spread to the surrounding area.