Versatile Laser Cutter and Engraver for Windows Operating Systems

Name: Versatile Laser Cutter and Engraver for Windows Operating Systems
Brand: Jiangsu Himalaya Semiconductor Co., Ltd.
SKU: 2084634862

Jiangsu, ChinaJiangsu Himalaya Semiconductor Co., Ltd.

US$50,000.00-100,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

Online Service

Warranty

12 Months

Model NO.

HM001

Laser Visibility

Invisible

Applicable Material

Metal

Cooling System

Air Cooling

Technical Class

Continuous Wave Laser

Laser Wavelength

Fiber Laser

Laser Classification

Fiber Laser

Type

YAG Laser Marking Machine

Marking Method

Scanning Marking

Laser Type

Picosecond Green Laser

Machine Weight

2000kg

Cutting Accuracy

±0.02mm

Power

2.5kw

Machine Size

1700×1650×1850mm

Processing Area

250mmx500mm

Transport Package

Air Freight

Specification

cusotmized

Trademark

Himalaya

Origin

China

Production Capacity

50000

Key features

Picosecond Green Laser: 532nm wavelength with ultra-short pulses minimizes heat-affected zones for delicate materials.

Zero Thermal Damage: Ablates material without melting edges, ideal for OLED displays and wafer dicing.

Customizable Work Area: Standard 250mm x 500mm adaptable to larger sizes for various production scales.

High Rigidity Frame: 2000kg heavy-duty construction minimizes vibration for stable high-speed operation.

Dual Platform Design: Improves efficiency with arbitrary fiducial setting and automatic target finding.

Flexible Customization: OEM/ODM services available with flexible customization options for specific needs.

12 Months Warranty: Comprehensive one-year warranty coverage with 24-hour online technical support.

Company profile

QA/QC InspectorsR&D CapabilitiesImporters and ExportersQuality Assurance

Jiangsu Himalaya Semiconductor Co., Ltd.

Jiangsu, China

Business Type: Manufacturer/Factory CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Flexible customization CertifiedExport Year: 5 Years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤2.58h

About Our Factory & Business Background

AddressRoom 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China

Registered Capital100,000,000 RMB

Terms of PaymentLC, T/T, PayPal, Western Union

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months

Minimum Order Quantity1 Set

Supply Chain Partners30

Our Production Capability & Technical Expertise

Main ProductsDie Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, Automatic Silicone Dispensing Equipment

Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

Traceability of Raw MaterialsNo

Our Industry Experience & Global Business Record

Year of Establishment2019-09-12

Main MarketsEurope

Repeat Buyers Choice80%~100%

Product Q&A

Q:How to choose a suitable machine?

You can tell us the working piece material, size, and the request of machine function. We can recommend the most suitable machine according to our experience.

Q:What is the warranty period for the equipment?

One year warranty and 24 hours online professional technical support.

Q:Why choose us?

OEM/ODM Designing.

Q:What is the laser wavelength?

The machine uses a Picosecond green laser with a wavelength of 532nm.

Q:What materials can this laser cut?

It is ideal for brittle or heat-sensitive materials such as glass, ceramics, and thin-film circuits.