ISO9001, CE, UL Certificated High Temperature 1600 Degree MIM Debinding Sintering Oven

Name: ISO9001, CE, UL Certificated High Temperature 1600 Degree MIM Debinding Sintering Oven
Brand: Hunan Jingtan Automation Equipment Co., Ltd
SKU: 2219938715

Hunan, ChinaHunan Jingtan Automation Equipment Co., Ltd

US$10,000.00-80,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Provided

Warranty

One Year

Model NO.

JIT-MIM-720

Type

Sintering Furnace

Certification

CE, ISO

Structure

Horizontal Type

Brand

Jingtan

Working Size

600*600*2000mm

Volume

720L

Ultimate Temperture

1600℃

Temperature Uniformity

≤±5℃

Temperature Measurement

Infrared Optical Measurement

Working Atmosphere

Vacuum

Temperature Measurement Contro

Program Control and Manual Control

Temperature Measurement Accuracy

0.2-0.75%

Temperature Control Accuracy

±1℃

Ultimate Heating Rate

75℃/Min

Transport Package

Wooden Case

Specification

600*600*2000mm

Trademark

Jingtan

Origin

China

HS Code

8514191000

Production Capacity

30set/Quarter

Company profile

Self-brandedPatents AwardedProduct Certification100% Finished Products Inspection

Hunan Jingtan Automation Equipment Co., Ltd

Hunan, China

Business Type: Manufacturer/Factory, Trading CompanyNearest Port: Shenzhen, ShanghaiAverage Response Time: ≤0.65hTerms of Payment: T/T, LCInternational Commercial Terms(Incoterms): FOB, EXW, CIF, CFR, CIP, CPT, FCA

AI-Powered supplier vetting

SummaryThe supplier operates across semiconductor-related equipment, mechanical and electrical equipment, pumps, automation systems, and hardware products. It reports ISO9001:2015 and CE certification, customization from designs and samples, full and minor customization, and new-product development during the past year. Production information includes two production lines, fewer than five quality-control staff, and listed furnace equipment with 50 sets. Export activity is reported at 71%–90%, with markets across multiple regions. However, the supplier has no written records or procedures for corrective actions, complaint handling, or finished-product inspection, and lacks overseas agents, branches, warehouses, showrooms, and offline trade-show participation. Financial information is recorded as zero for the stated periods, so financial credibility cannot be positively established. No customer cases are provided.

Supplier typeThe supplier is positioned as a manufacturer and seller of semiconductor discrete-device and electronic special equipment, mechanical and electrical equipment, pumps, automation systems, and related hardware. The provided business scopes indicate a diversified industrial-equipment supplier rather than a narrowly defined product specialist.

CertificationsThe supplier reports an ISO9001:2015 certificate and CE certification. These are explicit certification holdings, although the slices do not provide certificate validity dates, scope, or issuing-body details.

After-Sales capabilityThe supplier reports inventory capability and accepts FOB, CIF, CFR, and EXW quotation terms, but has no written corrective-action or complaint-handling procedures or records. It also lacks overseas warehouses, showrooms, agents, and branches, indicating limited documented after-sales infrastructure.

R&D capabilityThe supplier reports new products during the past year and total R&D-engineer experience of 6–10 years. These details support active R&D capability, although the supplier does not provide 3D software design services.

Production capacityThe supplier operates two production lines, reports inventory capability, and lists cutting, welding, drilling, lathe, assembly, and furnace-related equipment, including 50 listed furnace sets. However, fewer than five quality-control staff and the absence of written finished-product inspection records indicate weaknesses in documented production-quality control.

Customization capabilityThe supplier explicitly provides customization from designs, customization from samples, full customization, and minor customization. This is supported in two separate capability records, despite the lack of 3D software design service.