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Asm Tel Semiconductor Used Wafer Front-End Fab Thin Film Deposition Equipment
US$185,000.00-395,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

High Temperature Resistance

Model NO.

ASM TEL

Demoulding

Automatic

Condition

Used

Certification

RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Delivery

1-7 Days

MOQ

1PC

Quality

100% Tested

Adaptation

Thin Film Deposition Equipment

Inventory

Availability

Transport Package

Wooden Case

Specification

2800*2000*1800

Trademark

Novellus

Origin

USA

HS Code

8479909090

Production Capacity

20

Key features

Integrates in situ film thickness monitoring with advanced feedback algorithms to adjust deposition rates and gas flows in real time, ensuring batch-to-batch film thickness repeatability better
In addition to standard silicon wafers, it can stably process silicon carbide, gallium nitride, sapphire, and glass substrates, meeting the needs of diverse applications such as power devices, RF, and
Optimized RF power efficiency and exhaust gas abatement design reduce energy consumption by 20%; an easy-to-maintain chamber structure enables rapid spare part replacement, effectively minimizing equi
Stable and uniform film thickness
Good step coverage performance

Company profile

Importers and ExportersSelf-brandedYears of Export ExperienceHigh Repeat Buyers Choice
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤5.65h

About Our Factory & Business Background

AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10

Our Production Capability & Technical Expertise

Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Product Q&A

Q:What products can you provide?
A:
Lithography machine Etching machine Track system (Coater/Developer) Thin-film deposition equipment Ion implanter Thermal processing equipment (Oxidation/Diffusion/Annealing) CMP system Semiconductor inspection and metrology equipment (M&I equipment) semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is the MOQ?
A:
Yes, samples are available. The Minimum Order Quantity (MOQ) is 1 piece.
Q:How long will it take to deliver the goods?
A:
Delivery typically takes about 7 to 14 working days.
Q:What kinds of brands of machines can you provide?
A:
I can supply dicing saws from world-renowned brands such as K&S, ASM, DISCO, and Tokyo Seimitsu
Q:What is the warranty for Thin Film Deposition Equipment ?
A:
We provide a 6-month warranty on new machines and a 3-month warranty on used machines. If an item fails immediately upon receipt, we offer free replacement or a refund.

Send Inquiry

*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
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