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Asmpt Siplace Ca4 Die Bonding Machine Semiconductor Equipment Flip Chip Bonder
US$19,999.00-23,999.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
24 Hrs OnlineFunction
High Temperature ResistanceModel NO.
CA4Demoulding
AutomaticCondition
NewCertification
RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1PCQuality
100% TestedAdaptation
Die BonderInventory
AvailabilityTransport Package
Wooden CaseSpecification
180*180*180Trademark
asmOrigin
GermanyHS Code
8479909090Production Capacity
20Key features
Quad-gantry parallel operation, achieving placement speeds up to 200,000 CPH.
supporting components from 01005 to 15mm.
Integrated wafer and tape feeders, enabling hybrid assembly of flip chip and SMT.
Company profile
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤6.91h
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10
Our Production Capability & Technical Expertise
Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Product Q&A
Q:What products can you provide?
A:
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is your MOQ?
A:
Yes, the sample is available, and our MOQ is 1 piece.
Q:How long will it take to deliver the goods?
A:
About 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
We have asmpt,besi, etc.
Q:What is the warranty of machine ?
A:
We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.
Send Inquiry
*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
Supplier replies will be sent to your registered email
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