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High-Precision Used Back-End Semiconductor Die Bonding Machine Asm Ca2 Die Bonder
US$30,000.00-40,999.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
24 Hrs OnlineFunction
High Temperature ResistanceModel NO.
CA2Demoulding
AutomaticCondition
NewCertification
RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1PCQuality
100% TestedAdaptation
Die BonderInventory
AvailabilityTransport Package
Wooden CaseSpecification
1900*1900*1900Trademark
asmOrigin
GermanyHS Code
8479909090Production Capacity
20Key features
Dual-gantry parallel placement, doubling throughput with high efficiency.
Intelligent vision alignment, achieving micron-level component centering.
Modular feeder platform, enabling quick changeover for diverse product mixes.
Company profile
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤3.45h
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10
Our Production Capability & Technical Expertise
Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Product Q&A
Q:What products can you provide?
A:
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is your MOQ?
A:
Yes, the sample is available, and our MOQ is 1 piece.
Q:How long will it take to deliver the goods?
A:
About 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
We have asmpt,besi, etc.
Q:What is the warranty of machine ?
A:
We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.
Send Inquiry
*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
Supplier replies will be sent to your registered email
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