Used Automatic Semiconductor Die Bonding Equipment Besi Datacon 8800 Chameo Advanced Wedge Wire Bonder

Name: Used Automatic Semiconductor Die Bonding Equipment Besi Datacon 8800 Chameo Advanced Wedge Wire Bonder
Brand: Guangdong Xinling Intelligent Equipment Co., Ltd
SKU: 2288459075

Guangdong, ChinaGuangdong Xinling Intelligent Equipment Co., Ltd

US$294,000.00-440,000.00

1 Piece

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

High Temperature Resistance

Model NO.

Datacon 8800 CHAMEO advanced

Demoulding

Automatic

Condition

Used

Certification

CCC, PSE, FDA, RoHS, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Delivery

1-7 Days

MOQ

1PC

Quality

100% Tested

Adaptation

Wire Bonder

Inventory

Availability

Transport Package

Wooden Case

Specification

2600*1700*2000

Trademark

besi

Origin

Netherlands

HS Code

8479909090

Production Capacity

Key features

Benchmark-level Precision and Hybrid Bonding Capabilities

While maintaining high precision, both speed and production capacity have been significantly enhanced. Substantial Increase in Output: This platform is capable of processing up to 2,000 chips per hour

Supports Dual-Side Mounting: Accommodates both face-down (flip-chip) and face-up mounting configurations, perfectly meeting the diverse requirements of various wafer-level fan-out packaging applicatio

Company profile

Importers and ExportersSelf-brandedYears of Export ExperienceHigh Repeat Buyers Choice

Guangdong Xinling Intelligent Equipment Co., Ltd

Guangdong, China

Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤7.27h

About Our Factory & Business Background

AddressShenzhen, Guangdong, China

Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment

International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Minimum Order Quantity1 pc

Supply Chain Partners10

Our Production Capability & Technical Expertise

Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester

QA/QC inspectors1 people

Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)

Inspection Method for Finished ProductsFinished product checked by packing staff

R&D Engineers5 people

Traceability of Raw MaterialsYes

Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsEurope

Number of Foreign Trading Staff3

Overseas Agent/BranchNo

New Products Launched in Last yearYes

Product Q&A

Q:What products can you provide?

Placement Machine Feeder, SMT Placement Machine, SMT AOI, SMT SPI, SMT Stencil Printer, SMT Reflow Oven, SMT X-Ray, SMT Feeder, SMT Nozzle, LED Pick & Place Machine, Wave Soldering Machine, SMT Coating Machine, SMT Cleaning Machine, SMT Label Mounter, PCB Cutting Machine, PCB Laser Printer Machine, PCB Handling Machine, SMT Mounter, Placement Machine, Placement Machine Accessories, SMT Accessories.

Q:Can I get a sample? What is your MOQ?

Yes, the sample is available, our MOQ is 1 piece.

Q:How long will it take to deliver the goods?

About 1 to 7 working days.

Q:What kinds of brands of parts can you provide?

We have Fuji, Juki, Yamaha, Samsung, Panasonic, Siemens, Universal, Hitachi, etc.

Q:What is the warranty of SMT machine accessories?

We provide 6 months warranty on new accessories and 3 months on Second accessories, actual life depends on working and maintenance. If it can not work after newly received, free replacement would be sent immediately or refund.