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Used Back-End Semiconductor Equipment Neontech NDS-5200 Dicing Saw
US$45,000.00-55,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

24 Hrs Online

Function

High Temperature Resistance

Model NO.

NDS-5200

Demoulding

Automatic

Condition

Used

Certification

RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Installation

Vertical

Driven Type

Electric

Mould Life

300,000-1,000,000 Shots

Delivery

1-7 Days

MOQ

1PC

Quality

100% Tested

Adaptation

Dicing Saw

Inventory

Availability

Transport Package

Wooden Case

Specification

2000*1800*1800

Trademark

NeonTech

HS Code

8479909090

Production Capacity

20

Key features

The opposing dual-spindle configuration one of the signature designs in their product line achieves a manifold increase in production efficiency by positioning two cutting spindles opposite one anothe
While enhancing efficiency, the new models also place a strong emphasis on conserving energy and space
When processing third generation semiconductors such as SiC silicon carbide and GaN gallium nitride as well as structurally fragile components like MEMS micro-electromechanical systems

Company profile

Importers and ExportersSelf-brandedYears of Export ExperienceHigh Repeat Buyers Choice
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤2.67h

About Our Factory & Business Background

AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10

Our Production Capability & Technical Expertise

Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Product Q&A

Q:What products can you provide?
A:
Lithography machine Etching machine Track system (Coater/Developer) Thin-film deposition equipment Ion implanter Thermal processing equipment (Oxidation/Diffusion/Annealing) CMP system Semiconductor inspection and metrology equipment (M&I equipment) semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is the MOQ?
A:
Yes, samples are available. The Minimum Order Quantity (MOQ) is 1 piece.
Q:How long will it take to deliver the goods?
A:
Delivery typically takes about 1 to 7 working days.
Q:What kinds of brands of parts can you provide?
A:
Disco,Tokyo Seimitsu / ACCRETECH,ASMPT
Q:What is the warranty for Semiconductor Dicing Machine
A:
We provide a 6-month warranty on new machine and a 3-month warranty on second-hand machine. If an item fails immediately upon receipt, we offer free replacement or a refund.

Send Inquiry

*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
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