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Used China Automatic Asml Xt 1400ei Supplier Semiconductor Wafer Fab Lithography Machine
US$512,000.00-1,500,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
24 Hrs OnlineFunction
Lithography MachineModel NO.
XT 1400EiDemoulding
AutomaticCondition
UsedCertification
CCC, PSE, FDA, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1PCQuality
100% TestedAdaptation
Lithography MachineInventory
AvailabilityTransport Package
Wooden CaseSpecification
2500*2000*2000Trademark
ASMLOrigin
The NetherlandsHS Code
8479909090Production Capacity
20Key features
Featuring a modular design, it supports rapid configuration and reconfiguration, flexibly adapts to various substrate sizes and process requirements, and facilitates production line upgrades and maint
Integrates a sub-micron, high-resolution projection optical system with an automatic camera focusing function, and utilizes image processing software for dense pattern overlay alignment, effectively r
Equipped with an optimized sensor system and designed to minimize particle generation, it ensures contamination-free imaging across all stages, thereby enhancing inspection accuracy and yield.
Company profile
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤4.41h
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10
Our Production Capability & Technical Expertise
Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Product Q&A
Q:What products can you provide?
A:
Lithography machine
Etching machine
Track system
Thin film deposition equipment
Ion implanter
Thermal processing equipment
Chemical mechanical polishing system
M&I equipment
semiconductor equipment,including .Wafer Cleaner,Wafer Grinder,Probe Station,Dicing Saw,Die Bonder,Flip Chip Bonder,Wire Bonder,Molding Machine,Test Handler,Semiconductor Tester,AA Optical Module Machine.
Q:Can I get a sample and what is the MOQ?
A:
Yes, samples are available. The Minimum Order Quantity (MOQ) is 1 piece.
Q:How long will it take to deliver the goods?
A:
Delivery typically takes about 7 to 14 working days.
Q:What kinds of brands of machines can you provide?
A:
ASML Lithography machine
Q:What is the warranty for Lithography machine ?
A:
We provide a 6-month warranty on new machines and a 3-month warranty on used machines. If an item fails immediately upon receipt, we offer free replacement or a refund.
Send Inquiry
*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
Supplier replies will be sent to your registered email
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