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Wafer Cutting Machine Disco Dfd6450 Wafer Slicer Dicing Machine Semiconductor Equipment
US$19,999.00-23,999.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
24 Hrs OnlineFunction
High Temperature ResistanceModel NO.
DFD6450Demoulding
AutomaticCondition
NewCertification
RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticInstallation
VerticalDriven Type
ElectricMould Life
300,000-1,000,000 ShotsDelivery
1-7 DaysMOQ
1PCQuality
100% TestedAdaptation
Dicing MachineInventory
AvailabilityTransport Package
Wooden CaseSpecification
180*180*180Trademark
discoOrigin
JapanHS Code
8479909090Production Capacity
20Company profile
Business Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 13 years CertifiedNearest Port: shenzhne portAverage Response Time: ≤8.07h
About Our Factory & Business Background
AddressShenzhen, Guangdong, China
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 pc
Supply Chain Partners10
Our Production Capability & Technical Expertise
Main ProductsWafer Cleaner, Wafer Grinder, Probe Station, Dicing Saw, Die Bonder, Flip Chip Bonder, Wire Bonder, Molding Machine, Test Handler, Semiconductor Tester
QA/QC inspectors1 people
Inspection Type for Finished ProductsRandom inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsFinished product checked by packing staff
R&D Engineers5 people
Traceability of Raw MaterialsYes
Own BrandYes
Our Industry Experience & Global Business Record
Main MarketsEurope
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes
Send Inquiry
*To:Guangdong Xinling Intelligent Equipment Co., Ltd
*Content:
Supplier replies will be sent to your registered email
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