High Performance Npm-D3 Panasonic SMT Mounter Machine Pick and Place Equipment.

Name: High Performance Npm-D3 Panasonic SMT Mounter Machine Pick and Place Equipment.
Brand: Shenzhen HTGD Intelligent Equipment Co., Ltd.
SKU: 1994813841

Guangdong, ChinaShenzhen HTGD Intelligent Equipment Co., Ltd.

US$5,000.00-8,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Technical Support, Maintenance Services

Condition

Used

Model NO.

NPM-D3

Speed

High Speed

Precision

High Precision

Certification

CCC, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Placement Speed

38500cph

Transport Package

Wooden Boxes

Specification

890 *2370 * 1930 mm

Trademark

panasonic

Origin

Japan

HS Code

8479909090

Production Capacity

50 Sets/Year

Key features

1. Integrated Placement & Inspection System for High-Efficiency and High-Quality Production Meets your assembly requirements with selectable High-Production mode or High-Precision mode

2. Accommodates Large Substrates and Large Components

Company profile

Shenzhen HTGD Intelligent Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T

AI-Powered supplier vetting

SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a high-tech enterprise specializing in high-end automation equipment, with a strong focus on R&D, production, and sales. Established in 2014, it operates primarily in the SMT industry and has a substantial export business, with 90% of sales from exports. The company emphasizes quality and international certification, holding ISO and CE certifications. It operates three production lines and employs 120 people, including 6-10 quality control staff. HTGD is capable of customization and provides technical support and after-sales services.

Supplier typeThe supplier is identified as a 'Combined' type business entity with a nature as a trading company, and it is a limited company.

CertificationsThe company holds ISO certification and CE approval for its machines, indicating a commitment to international standards.

After-Sales capabilityHTGD provides technical support and excellent after-sales service, ensuring customer satisfaction.

R&D capabilityThe company has been involved in R&D since 2008 and has significant experience in the SMT industry, indicating strong innovation capability.

Production capacityThe company operates three production lines with a facility of 10,000 square meters and has a capacity of producing 2000 sets of machines annually.

Customization capabilityHTGD offers customizable solutions for various circuit board sizes, demonstrating its customization capability.

Product Q&A

Q:What is the maximum PCB size that the NPM-W2 can handle?

With the single-lane conveyor specification, it can handle boards up to L750 x W550 mm. With the dual-lane conveyor option, in dual-lane mode it handles up to L750 x W260 mm, and in single-lane mode up to L750 x W510 mm.

Q:What is the maximum placement speed and what head types are available?

The Lightweight 16-nozzle head reaches up to 77,000 CPH under optimal conditions. Other heads include a 12-nozzle head (64,500 CPH), an 8-nozzle head (40,000 CPH), and a 3-nozzle head (16,000 CPH). Heads can be freely combined per work table.

Q:Can the NPM-W2 place 03015 (01005) ultra-small components?

Yes. When the optional "03015 mounting support" is selected, the Lightweight 16-nozzle head can place 03015 chips. This requires dedicated 276CS (or 276CSN) nozzles and a 4mm thin-type single tape feeder.

Q:What features improve efficiency and quality?

For efficiency, it supports independent mounting mode (one lane produces while the other changes over), and optional automatic pin support changer and automatic product changeover. For quality, the optional Multi-function Recognition Camera Type 2/3 provides component thickness measurement and 3D inspection. The APC system uses solder paste inspection data to feed forward placement corrections.