Lead Free 8 Zones Reflow Oven

Name: Lead Free 8 Zones Reflow Oven
Brand: Shenzhen HTGD Intelligent Equipment Co., Ltd.
SKU: 1917833625

Guangdong, ChinaShenzhen HTGD Intelligent Equipment Co., Ltd.

US$4,000.00-12,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Technical Support, Maintenance Services

Condition

New

Model NO.

GDK-0802-N

Certification

CCC, RoHS, ISO, CE

Warranty

24 Months

Automatic Grade

Automatic

Installation

Vertical

Main Color

Industrial Computers White

Heating Time

About 25 Mins

Transport Speed

400-2000 mm/Min, Chain Guide at Same Speed

Temperature Control Accuracy

+/-1 Degrees Centigrade

PCB Maximum Width

400 mm (Optional :610 mm)

Guide Rail Width

50 mm-400mm (50 mm-610mm Optional)

Guide Rail Fixing Mode

Front End Fixing (Optional: Back End Fixing)

Number of Heating Zones

Up8 Under 8

Cooling Areas

Up2 Under 2

Cooling Mode

Cooling of External Water Cooler

Guide Rail Structure

Whole Two-Section

Transport Package

Wooden Case Packing Vacuum Packing

Specification

L5250*W1420*H1520 mm

Trademark

GDK

Origin

China

HS Code

8514109000

Production Capacity

2000sets/Year

Company profile

Shenzhen HTGD Intelligent Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T

AI-Powered supplier vetting

SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a China-based limited company involved in SMT automation equipment, particularly solder paste stencil printers and related dispensing or inspection applications. The provided information describes research and development, production, sales, service, technical support, process improvement, and customization. It reports ISO certification and CE approval, export activity beginning in 2014, and exports representing 90% of total sales. Production-related information includes a stated annual capacity of 2,000 machines, three production lines, a 10,000-square-meter workshop, and 120 employees, although some company descriptions report different office or facility sizes and employee counts. The supplier shows evidence of technical and customization capabilities, but no specific customer names, project references, financial information, or detailed certification scope is provided.

CertificationsThe supplier states that it has international quality certification and specifically reports being ISO certified, with CE approval for its machines. These statements provide explicit evidence of certification holdings, although the specific ISO standard and certificate scope are not stated.

After-Sales capabilityThe supplier explicitly states that it provides service improvement, technical support, excellent after-sales service, and effective solutions. Its stated process-improvement experience and customer recommendations support an after-sales capability, although service response times and service coverage are not provided.

R&D capabilityThe supplier reports R&D activity in automatic solder paste printing since 2008, a professional SMT technical focus, process-improvement expertise, and 20 R&D engineers. It also describes precision inspection and dispensing applications, indicating relevant technical development capability.

Production capacityProduction indicators include a stated 10,000-square-meter standard equipment workshop, 2,000-machine annual capacity, three production lines, and 120 employees. The supplier also reports multiple SMT equipment products and a production-oriented business description, providing explicit evidence of production capability despite differing facility and employee figures in some slices.

Customization capabilityThe supplier states that its solder paste stencil printers can support multiple circuit-board sizes and can be specially designed through customization. Its listed dispensing coverage includes FPC, camera modules, LED displays, mobile phone frames, and underfill applications, demonstrating product and application flexibility.