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Panasonic Npm-Tt2 Chip Mounter Pick and Place Machine
US$5,000.00-8,000.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
Technical Support, Maintenance ServicesCondition
UsedModel NO.
Npm-TT2Speed
High SpeedPrecision
High PrecisionCertification
CCC, RoHS, ISO, CEWarranty
6 MonthsAutomatic Grade
AutomaticType
High-speed Chip MounterPlacement Speed
18000cphTransport Package
Wooden BoxesSpecification
1300 *2798 * 1444 mmTrademark
panasonicOrigin
JapanHS Code
8479909090Production Capacity
50 Sets/YearKey features
High-Speed Mounting: Achieves up to 18,000 CPH with 0.2s/chip cycle time for maximum productivity.
Versatile Mounting Heads: Options include lightweight 8-nozzle head or 3-nozzle V2 for odd-form components.
Multi-Function Camera: Equipped with height recognition camera for stable high-speed mounting of odd-form parts.
Flexible Feeder Configuration: Supports reorganizable tray feeder base and exchangeable trucks for various supply shapes.
Independent Mounting: Enables fully independent mounting of tray components to enhance overall line productivity.
Direct Connectivity: Connects directly to NPM-D3/W2 for a highly versatile and productive production line.
Auto Pin Change Function: Optional support for automated pin position changing to prevent errors and save labor.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T
AI-Powered supplier vetting
SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a high-tech enterprise specializing in high-end automation equipment, with a strong focus on R&D, production, and sales. Established in 2014, it operates primarily in the SMT industry and has a substantial export business, with 90% of sales from exports. The company emphasizes quality and international certification, holding ISO and CE certifications. It operates three production lines and employs 120 people, including 6-10 quality control staff. HTGD is capable of customization and provides technical support and after-sales services.
Supplier typeThe supplier is identified as a 'Combined' type business entity with a nature as a trading company, and it is a limited company.
CertificationsThe company holds ISO certification and CE approval for its machines, indicating a commitment to international standards.
After-Sales capabilityHTGD provides technical support and excellent after-sales service, ensuring customer satisfaction.
R&D capabilityThe company has been involved in R&D since 2008 and has significant experience in the SMT industry, indicating strong innovation capability.
Production capacityThe company operates three production lines with a facility of 10,000 square meters and has a capacity of producing 2000 sets of machines annually.
Customization capabilityHTGD offers customizable solutions for various circuit board sizes, demonstrating its customization capability.
Product Q&A
Q:What is the maximum placement speed and accuracy of the NPM-TT2?
A:
The speed and accuracy depend on the mounting head used.
Lightweight 8-nozzle head: Up to 36,000 CPH (0.1 sec/chip) for chips. Accuracy for 0402, 0603, 1005 chips is +/- 0.04mm (Cpk >= 1). For QFP components up to 12x12mm it is +/- 0.05mm (Cpk >= 1); for QFP from 12x12mm to 32x32mm it is +/- 0.03mm (Cpk >= 1).
3-nozzle head: Up to 11,800 CPH (0.305 sec/QFP) for QFP and 14,400 CPH (0.25 sec/chip) for chips. QFP accuracy is +/- 0.03mm (Cpk >= 1).
Q:What is the largest component the NPM-TT2 can handle? Can it place odd-shaped parts?
A:
Yes, the NPM-TT2 is very versatile, especially for odd-shaped components.
8-nozzle head: Handles from 0402 chips up to 32x32mm, max height 12mm.
3-nozzle head: Handles from 0603 chips up to 150x25mm or 120x90mm, max height 30mm, max weight 30g. This makes it ideal for large connectors, shields, and other irregular parts.
Q:What mounting modes does the NPM-TT2 support? How can it change models without stopping production?
A:
It supports single-lane and dual-lane modes. In dual-lane mode there are three options:
Alternate mounting mode: Both heads alternate between two lanes to minimize board transfer loss.
Alternate front/rear mode: Only one lane is active, useful for unbalanced workloads.
Independent mounting mode: Each head works on its own lane independently. This enables non-stop model changeover: while one lane continues production, the other lane can be stopped to switch models (change data, feeders, trays,
Q:It supports single-lane and dual-lane modes. In dual-lane mode there are three options:
Alternate mounting mode: Both heads alternate between two lanes to minimize board transfer loss.
Alternate fro
A:
Several advanced features contribute to high quality:
Multi-function recognition camera (type 2/3): Measures component thickness to detect tombstoning and tilted picks, and adjusts mounting height. Type 3 adds 3D measurement to check lead coplanarity of QFP/SOP and detect missing or loose solder balls on BGA/CSP.
Height sensor: Measures board warpage and controls nozzle height during placement to prevent defects.
APC (Advanced Process Control) system: Receives solder paste inspection data and
Send Inquiry
*To:Shenzhen HTGD Intelligent Equipment Co., Ltd.
Shenzhen HTGD Intelligent Equipment Co., Ltd.*Content:
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