Panasonic Npm-W2 High Speed Pick and Place Machine Chip Mounter for PCB Assembly and Electronics Manufacturing

Name: Panasonic Npm-W2 High Speed Pick and Place Machine Chip Mounter for PCB Assembly and Electronics Manufacturing
Brand: Shenzhen HTGD Intelligent Equipment Co., Ltd.
SKU: 1995534521

Guangdong, ChinaShenzhen HTGD Intelligent Equipment Co., Ltd.

US$5,000.00-8,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Technical Support, Maintenance Services

Condition

Used

Model NO.

NPM-W2

Speed

High Speed

Precision

High Precision

Certification

CCC, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Placement Speed

38500cph

Transport Package

Wooden Boxes

Specification

890 *2370 * 1930 mm

Trademark

panasonic

Origin

Japan

HS Code

8479909090

Production Capacity

50 Sets/Year

Key features

Large Substrate Support: Accommodates PCBs up to 750 x 550 mm with components up to 150 x 25 x 30 mm.

Dual-Lane Configuration: Optional dual-lane placement for maximum productivity per unit area.

Integrated System: Combines printing, placement, and inspection for high-efficiency production.

Flexible Placement Modes: Supports Independent, Alternate, and Mixed Placement methods.

Comprehensive Warranty: One-year free warranty with lifelong maintenance and free software upgrades.

Global Service Network: Overseas branches and agents provide door-to-door and on-site support.

CE and ISO Certified: Company and machines certified by CE, ISO, and TUV standards.

Company profile

Shenzhen HTGD Intelligent Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T

AI-Powered supplier vetting

SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a China-based limited company involved in SMT automation equipment, particularly solder paste stencil printers and related dispensing or inspection applications. The provided information describes research and development, production, sales, service, technical support, process improvement, and customization. It reports ISO certification and CE approval, export activity beginning in 2014, and exports representing 90% of total sales. Production-related information includes a stated annual capacity of 2,000 machines, three production lines, a 10,000-square-meter workshop, and 120 employees, although some company descriptions report different office or facility sizes and employee counts. The supplier shows evidence of technical and customization capabilities, but no specific customer names, project references, financial information, or detailed certification scope is provided.

CertificationsThe supplier states that it has international quality certification and specifically reports being ISO certified, with CE approval for its machines. These statements provide explicit evidence of certification holdings, although the specific ISO standard and certificate scope are not stated.

After-Sales capabilityThe supplier explicitly states that it provides service improvement, technical support, excellent after-sales service, and effective solutions. Its stated process-improvement experience and customer recommendations support an after-sales capability, although service response times and service coverage are not provided.

R&D capabilityThe supplier reports R&D activity in automatic solder paste printing since 2008, a professional SMT technical focus, process-improvement expertise, and 20 R&D engineers. It also describes precision inspection and dispensing applications, indicating relevant technical development capability.

Production capacityProduction indicators include a stated 10,000-square-meter standard equipment workshop, 2,000-machine annual capacity, three production lines, and 120 employees. The supplier also reports multiple SMT equipment products and a production-oriented business description, providing explicit evidence of production capability despite differing facility and employee figures in some slices.

Customization capabilityThe supplier states that its solder paste stencil printers can support multiple circuit-board sizes and can be specially designed through customization. Its listed dispensing coverage includes FPC, camera modules, LED displays, mobile phone frames, and underfill applications, demonstrating product and application flexibility.

Product Q&A

Q:What is the maximum PCB size that the NPM-W2 can handle?

With the single-lane conveyor specification, it can handle boards up to L750 x W550 mm. With the dual-lane conveyor option, in dual-lane mode it handles up to L750 x W260 mm, and in single-lane mode up to L750 x W510 mm.

Q:What is the maximum placement speed and what head types are available?

The Lightweight 16-nozzle head reaches up to 77,000 CPH under optimal conditions. Other heads include a 12-nozzle head (64,500 CPH), an 8-nozzle head (40,000 CPH), and a 3-nozzle head (16,000 CPH). Heads can be freely combined per work table.

Q:Can the NPM-W2 place 03015 (01005) ultra-small components?

Yes. When the optional "03015 mounting support" is selected, the Lightweight 16-nozzle head can place 03015 chips. This requires dedicated 276CS (or 276CSN) nozzles and a 4mm thin-type single tape feeder.

Q:What features improve efficiency and quality?

For efficiency, it supports independent mounting mode (one lane produces while the other changes over), and optional automatic pin support changer and automatic product changeover. For quality, the optional Multi-function Recognition Camera Type 2/3 provides component thickness measurement and 3D inspection. The APC system uses solder paste inspection data to feed forward placement corrections.