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SMD Pick and Place Machine

Name: SMD Pick and Place Machine
Brand: Shenzhen HTGD Intelligent Equipment Co., Ltd.
SKU: 1913953915

Guangdong, ChinaShenzhen HTGD Intelligent Equipment Co., Ltd.

US$20,000.00-50,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Technical Support, Maintenance Services,

Condition

Used

Model NO.

Speed

High Speed

Precision

High Precision

Certification

CCC, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Transport Package

Wooden Boxes

Specification

1410*1500*1540mm

Trademark

Hanwha

Origin

Korea

Production Capacity

50 Sets/Year

Key features

High-Speed Placement: Up to 78,000 CPH placement speed for optimal efficiency.

Comprehensive Warranty: Includes one-year free warranty and lifelong maintenance services.

Free Software Upgrades: Lifetime free software system upgrades to ensure latest features.

Door-to-Door Service: Provides one-on-one designated service and on-site visits.

Global Certification: Certified with CE, ISO, TUV, CCC, and RoHS standards.

OEM/ODM Support: Offers OEM and ODM services for customized manufacturing needs.

Company profile

Shenzhen HTGD Intelligent Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T

AI-Powered supplier vetting

SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a China-based limited company involved in SMT automation equipment, particularly solder paste stencil printers and related dispensing or inspection applications. The provided information describes research and development, production, sales, service, technical support, process improvement, and customization. It reports ISO certification and CE approval, export activity beginning in 2014, and exports representing 90% of total sales. Production-related information includes a stated annual capacity of 2,000 machines, three production lines, a 10,000-square-meter workshop, and 120 employees, although some company descriptions report different office or facility sizes and employee counts. The supplier shows evidence of technical and customization capabilities, but no specific customer names, project references, financial information, or detailed certification scope is provided.

CertificationsThe supplier states that it has international quality certification and specifically reports being ISO certified, with CE approval for its machines. These statements provide explicit evidence of certification holdings, although the specific ISO standard and certificate scope are not stated.

After-Sales capabilityThe supplier explicitly states that it provides service improvement, technical support, excellent after-sales service, and effective solutions. Its stated process-improvement experience and customer recommendations support an after-sales capability, although service response times and service coverage are not provided.

R&D capabilityThe supplier reports R&D activity in automatic solder paste printing since 2008, a professional SMT technical focus, process-improvement expertise, and 20 R&D engineers. It also describes precision inspection and dispensing applications, indicating relevant technical development capability.

Production capacityProduction indicators include a stated 10,000-square-meter standard equipment workshop, 2,000-machine annual capacity, three production lines, and 120 employees. The supplier also reports multiple SMT equipment products and a production-oriented business description, providing explicit evidence of production capability despite differing facility and employee figures in some slices.

Customization capabilityThe supplier states that its solder paste stencil printers can support multiple circuit-board sizes and can be specially designed through customization. Its listed dispensing coverage includes FPC, camera modules, LED displays, mobile phone frames, and underfill applications, demonstrating product and application flexibility.