Used Panasonic Npm-Tt2 High Speed SMT Pick and Place Machine

Name: Used Panasonic Npm-Tt2 High Speed SMT Pick and Place Machine
Brand: Shenzhen HTGD Intelligent Equipment Co., Ltd.
SKU: 1999081431

Guangdong, ChinaShenzhen HTGD Intelligent Equipment Co., Ltd.

US$5,000.00-8,000.00

1 Set

Product profile

Customization

Available

After-sales Service

Technical Support, Maintenance Services

Condition

Used

Model NO.

NPM-TT2

Speed

High Speed

Precision

High Precision

Certification

CCC, RoHS, ISO, CE

Warranty

6 Months

Automatic Grade

Automatic

Type

High-speed Chip Mounter

Placement Speed

18000cph

Transport Package

Wooden Boxes

Specification

1300 *2798 * 1444 mm

Trademark

panasonic

Origin

Japan

HS Code

8479909090

Production Capacity

50 Sets/Year

Key features

High-Speed Mounting: Achieves up to 18,000 CPH with 0.2s/chip cycle time for maximum productivity.

Versatile Mounting Heads: Options include lightweight 8-nozzle head or 3-nozzle V2 for odd-form components.

Multi-Function Camera: Equipped with height recognition camera for stable high-speed mounting of odd-form parts.

Flexible Feeder Configuration: Supports reorganizable tray feeder base and exchangeable trucks for various supply shapes.

Independent Mounting: Enables fully independent mounting of tray components to enhance overall line productivity.

Direct Connectivity: Connects directly to NPM-D3/W2 for a highly versatile and productive production line.

Auto Pin Change Function: Optional support for automated pin position changing to prevent errors and save labor.

Company profile

Shenzhen HTGD Intelligent Equipment Co., Ltd.

Guangdong, China

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service AvailableExport Year: 2014-01-01 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤18h CertifiedTerms of Payment: T/T

AI-Powered supplier vetting

SummaryShenzhen HTGD Intelligent Equipment Co., Ltd. is a China-based limited company involved in SMT automation equipment, particularly solder paste stencil printers and related dispensing or inspection applications. The provided information describes research and development, production, sales, service, technical support, process improvement, and customization. It reports ISO certification and CE approval, export activity beginning in 2014, and exports representing 90% of total sales. Production-related information includes a stated annual capacity of 2,000 machines, three production lines, a 10,000-square-meter workshop, and 120 employees, although some company descriptions report different office or facility sizes and employee counts. The supplier shows evidence of technical and customization capabilities, but no specific customer names, project references, financial information, or detailed certification scope is provided.

CertificationsThe supplier states that it has international quality certification and specifically reports being ISO certified, with CE approval for its machines. These statements provide explicit evidence of certification holdings, although the specific ISO standard and certificate scope are not stated.

After-Sales capabilityThe supplier explicitly states that it provides service improvement, technical support, excellent after-sales service, and effective solutions. Its stated process-improvement experience and customer recommendations support an after-sales capability, although service response times and service coverage are not provided.

R&D capabilityThe supplier reports R&D activity in automatic solder paste printing since 2008, a professional SMT technical focus, process-improvement expertise, and 20 R&D engineers. It also describes precision inspection and dispensing applications, indicating relevant technical development capability.

Production capacityProduction indicators include a stated 10,000-square-meter standard equipment workshop, 2,000-machine annual capacity, three production lines, and 120 employees. The supplier also reports multiple SMT equipment products and a production-oriented business description, providing explicit evidence of production capability despite differing facility and employee figures in some slices.

Customization capabilityThe supplier states that its solder paste stencil printers can support multiple circuit-board sizes and can be specially designed through customization. Its listed dispensing coverage includes FPC, camera modules, LED displays, mobile phone frames, and underfill applications, demonstrating product and application flexibility.

Product Q&A

Q:What is the maximum placement speed and accuracy of the NPM-TT2?

The speed and accuracy depend on the mounting head used. Lightweight 8-nozzle head: Up to 36,000 CPH (0.1 sec/chip) for chips. Accuracy for 0402, 0603, 1005 chips is +/- 0.04mm (Cpk >= 1). For QFP components up to 12x12mm it is +/- 0.05mm (Cpk >= 1); for QFP from 12x12mm to 32x32mm it is +/- 0.03mm (Cpk >= 1). 3-nozzle head: Up to 11,800 CPH (0.305 sec/QFP) for QFP and 14,400 CPH (0.25 sec/chip) for chips. QFP accuracy is +/- 0.03mm (Cpk >= 1).

Q:What is the largest component the NPM-TT2 can handle? Can it place odd-shaped parts?

Yes, the NPM-TT2 is very versatile, especially for odd-shaped components. 8-nozzle head: Handles from 0402 chips up to 32x32mm, max height 12mm. 3-nozzle head: Handles from 0603 chips up to 150x25mm or 120x90mm, max height 30mm, max weight 30g. This makes it ideal for large connectors, shields, and other irregular parts.

Q:What mounting modes does the NPM-TT2 support? How can it change models without stopping production?

It supports single-lane and dual-lane modes. In dual-lane mode there are three options: Alternate mounting mode: Both heads alternate between two lanes to minimize board transfer loss. Alternate front/rear mode: Only one lane is active, useful for unbalanced workloads. Independent mounting mode: Each head works on its own lane independently. This enables non-stop model changeover: while one lane continues production, the other lane can be stopped to switch models (change data, feeders, trays,

Q:It supports single-lane and dual-lane modes. In dual-lane mode there are three options: Alternate mounting mode: Both heads alternate between two lanes to minimize board transfer loss. Alternate fro

Several advanced features contribute to high quality: Multi-function recognition camera (type 2/3): Measures component thickness to detect tombstoning and tilted picks, and adjusts mounting height. Type 3 adds 3D measurement to check lead coplanarity of QFP/SOP and detect missing or loose solder balls on BGA/CSP. Height sensor: Measures board warpage and controls nozzle height during placement to prevent defects. APC (Advanced Process Control) system: Receives solder paste inspection data and