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Embedded Esim Chip Mff2 Package for IoT Communication Device Esim
US$0.89
100 Pieces

Product profile

Customization

Available

Conductive Type

Unipolar Integrated Circuit

Integration

LSI

Model NO.

eSIM chip

Operating Temperature

-20℃+70℃

Shape

Flat

Technics

Semiconductor IC

Transport Package

Standard Packaging

Specification

Standard

Trademark

Original

Origin

China

HS Code

8523529000

Key features

MFF2 Package Design: Embedded eSIM chip in MFF2 package optimized for IoT communication devices.
Unipolar IC Technology: Features unipolar integrated circuit technology for efficient performance.
LSI Integration Level: Large Scale Integration (LSI) ensures high density and functionality.
Flat Shape Structure: Compact flat shape design suitable for embedded applications.
Semiconductor IC Class: High-quality semiconductor IC technology for stable operation.
Standard Packaging: Comes in standard packaging to ensure safe transport and storage.
China Origin: Manufactured in China with original trademark and standard compliance.

Company profile

Importers and ExportersR&D CapabilitiesQA/QC InspectorsHigh Repeat Buyers Choice
Business Type: Manufacturer/Factory, Trading CompanyAverage Response Time: >24h

About Our Factory & Business Background

AddressNo. 330, Xinxing Road, Development Zone, Nantong, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsDiesel Engine, Fuel Pumps, Fuel Injectors, ECU, Tensioners, Cylinder Head, Crankshaft, Belts, Gaskets
Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsSouth America, Eastern Europe, Southeast Asia, Oceania

Product Q&A

Q:What package type is used for this eSIM?
A:
This eSIM chip uses the MFF2 package design.
Q:What is the integration level of the chip?
A:
The chip features LSI (Large Scale Integration) technology.
Q:Where is this product manufactured?
A:
The product originates from China.
Q:What is the lead time for orders?
A:
The lead time is within 15 workdays for both peak and off-peak seasons.
Q:Is the product available in standard packaging?
A:
Yes, the product comes in standard packaging.

Send Inquiry

*To:Jiangsu Hongxin Semiconductor Technology Co., Ltd
*Content:
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