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Mff2 Form Factor Esim Chip Multi Profile Storage for IoT Module
US$0.89
100 Pieces
Product profile
Customization
AvailableConductive Type
Unipolar Integrated CircuitIntegration
LSIModel NO.
eSIM chipOperating Temperature
-20℃+70℃Shape
FlatTechnics
Semiconductor ICTransport Package
Standard PackagingSpecification
StandardTrademark
OriginalOrigin
ChinaHS Code
8523529000Key features
Multi-Profile Storage: Supports multiple eSIM profiles for flexible IoT connectivity.
Flat Shape Design: Compact flat form factor suitable for space-constrained modules.
LSI Integration: High integration level for efficient semiconductor IC performance.
Standard Packaging: Comes in standard packaging for safe and secure transport.
China Origin: Manufactured in China with original trademark certification.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyAverage Response Time: >24h
About Our Factory & Business Background
AddressNo. 330, Xinxing Road, Development Zone, Nantong, Jiangsu, China
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Our Production Capability & Technical Expertise
Main ProductsDiesel Engine, Fuel Pumps, Fuel Injectors, ECU, Tensioners, Cylinder Head, Crankshaft, Belts, Gaskets
Own BrandYes
Our Industry Experience & Global Business Record
Main MarketsSouth America, Eastern Europe, Southeast Asia, Oceania
Product Q&A
Q:What package type is used for this eSIM?
A:
This eSIM chip uses the MFF2 package design.
Q:What is the integration level of the chip?
A:
The chip features LSI (Large Scale Integration) technology.
Q:Where is this product manufactured?
A:
The product originates from China.
Q:What is the lead time for orders?
A:
The lead time is within 15 workdays for both peak and off-peak seasons.
Q:Is the product available in standard packaging?
A:
Yes, the product comes in standard packaging.
Send Inquiry
*To:Jiangsu Hongxin Semiconductor Technology Co., Ltd
*Content:
Supplier replies will be sent to your registered email
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