Powered by Made-in-China.com

Sgp. 32 Standard Esim Embedded SIM IC for Smart Automotive Device

Jiangsu, ChinaJiangsu Hongxin Semiconductor Technology Co., Ltd

Sgp. 32 Standard Esim Embedded SIM IC for Smart Automotive Device

US$0.68

1,000 Pieces

Product profile

Customization

Available

Conductive Type

Unipolar Integrated Circuit

Integration

LSI

Model NO.

eSIM chip

Operating Temperature

-20℃+70℃

Shape

Flat

Technics

Semiconductor IC

Transport Package

Standard Packaging

Specification

Standard

Trademark

Original

Origin

China

HS Code

8523529000

Key features

Standard eSIM IC: SGP.32 embedded SIM IC designed for smart automotive devices.

LSI Integration: Features Large Scale Integration for high performance and efficiency.

Unipolar Conductive Type: Utilizes unipolar integrated circuit technology for stable operation.

Flat Shape Design: Compact flat semiconductor IC shape suitable for embedded applications.

OEM Branding Available: Own brand services available for customized product identification.

Fast Peak Season Lead Time: Delivery within 15 workdays even during peak production seasons.

Fast Off-Season Lead Time: Delivery within 15 workdays during off-peak production seasons.

Company profile

Importers and ExportersR&D CapabilitiesQA/QC InspectorsHigh Repeat Buyers Choice

Jiangsu Hongxin Semiconductor Technology Co., Ltd

Jiangsu, China

Business Type: Manufacturer/Factory, Trading CompanyAverage Response Time: >24h

About Our Factory & Business Background

AddressNo. 330, Xinxing Road, Development Zone, Nantong, Jiangsu, China

Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays

Our Production Capability & Technical Expertise

Main ProductsDiesel Engine, Fuel Pumps, Fuel Injectors, ECU, Tensioners, Cylinder Head, Crankshaft, Belts, Gaskets

Own BrandYes

Our Industry Experience & Global Business Record

Main MarketsSouth America, Eastern Europe, Southeast Asia, Oceania

Product Q&A

Q:What package type is used for this eSIM?

A:

This eSIM chip uses the MFF2 package design.

Q:What is the integration level of the chip?

A:

The chip features LSI (Large Scale Integration) technology.

Q:Where is this product manufactured?

A:

The product originates from China.

Q:What is the lead time for orders?

A:

The lead time is within 15 workdays for both peak and off-peak seasons.

Q:Is the product available in standard packaging?

A:

Yes, the product comes in standard packaging.

Send Inquiry

*To:Jiangsu Hongxin Semiconductor Technology Co., Ltd

*Content:

0/4000

Supplier replies will be sent to your registered email