High Performance Core I5 Mini PC Fanless 2 LAN 6 COM

Name: High Performance Core I5 Mini PC Fanless 2 LAN 6 COM
Brand: Shenzhen Anstou Technology LTD
SKU: 2212019645

Guangdong, ChinaShenzhen Anstou Technology LTD

US$310.71-338.57

1 pieces

Sample price:US$318.36/piece.Request sample

Product profile

Customization

Available

Application Field

Industrial Control

Processor Type

Intel Core I5

Model NO.

P12B

Stratification

HardWare Layer

Range of Application

General

Bus Type

Not Bus Type

Certification

CE, RoHS, FCC, Kc

Type

Embedded Systems

Machine Word-Length

Instruction Type

RISC

Kernel

PIC

Video Card

Intel UHD Graphics

Memory

64GB

Size

Package Size 315*285*135mm

Memory Type

2*DDR4 So-DIMM 260 Pin

System

Support Windows 10, Linux

Processor Core

Quad Core

Plugs Type

Us, Jp, Cn, Au, UK, EU

HDD Rotation Speed

SSD

COM

6*RS232 COM Port

Use

Industrial

Display Port

1*HD+1*VGA

After-Sales Service

Return and Replacement

USB Port

4*USB 3.0 Port,2*USB 2.0 Port

LAN

2*RJ45 LAN Gigabit Ethernet Controller

Power

55W~80W

Transport Package

Color Bocx

Specification

Package size 320*260*80mm

Trademark

HYSTOU

Origin

Guangdong, China

HS Code

8471504090

Production Capacity

20000 Unit/ Month

Company profile

Shenzhen Anstou Technology LTD

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2014-12-01Nearest Port: SHENZHENAverage Response Time: ≤4.86hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CIF, DDP, DAP, Others, CPT

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier with software development, electronic-component manufacturing, mechanical equipment R&D, and related sales and import/export activities. It provides 3D software design and multiple customization modes, including sample-, design-, full-, minor-, and flexible customization. ISO 9001 certification is reported. Innovation evidence includes one R&D engineer and new products launched during the past year, but total R&D experience is below five years and no SDK is available. Production capacity is only partially demonstrated: annual output is stated as below the provided threshold and off-peak lead time is within 15 workdays. The supplier claims exports to multiple regions and OEM/ODM cooperation, but formal service procedures, complaint-handling records, corrective-action procedures, and approved supplier lists are absent. Overseas showroom, agent/branch, and trade-show capabilities are not reported as available. No customer cases are explicitly...

Supplier typeThe supplier is explicitly described as a professional technical supplier and operates in software, computer hardware, electronic components, power-electronic components, and mechanical equipment R&D. Its stated focus covers compact computers, rugged devices, software, and related equipment, indicating a technology-oriented manufacturer and solution provider.

CertificationsISO 9001 certification is explicitly reported. This supports the existence of a certified quality-management system, although no other certifications are stated in the provided information.

R&D capabilityInnovation capability is supported by professional technical R&D status, software and mechanical-equipment R&D activities, 3D design services, design collaboration, flexible customization, and new products launched during the past year. However, the supplier has one R&D engineer, total R&D experience below five years, and no available SDK, indicating capability with limitations in R&D scale and developer-platform support.

Production capacityThe supplier reports electronic-component and power-electronic-component manufacturing, flexible handling of small or batch orders, and off-peak lead time within 15 workdays. However, the stated annual production output is below the provided threshold, so the evidence supports operational production capability but not strong scale capacity.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. Its description also states that R&D collaborates on appearance, functionality, and software design, providing direct evidence of broad OEM/ODM and product-customization capability.