Hystou Mini PC H7 I5 Fanless Panel PC RJ45 LAN 2 COM Industrial Embedded Computer & Scm Fastest Response

Name: Hystou Mini PC H7 I5 Fanless Panel PC RJ45 LAN 2 COM Industrial Embedded Computer & Scm Fastest Response
Brand: Shenzhen Anstou Technology LTD
SKU: 2166182065

Guangdong, ChinaShenzhen Anstou Technology LTD

US$166.18-207.85

1 units

Sample price:US$166.18/piece.Request sample

Product profile

Customization

Available

Application Field

Industrial Control

Processor Type

Intel

Model NO.

H7-10th

Stratification

HardWare Layer

Range of Application

General

Bus Type

Not Bus Type

Certification

CE, RoHS, FCC, Kc

Type

Embedded Computer

Machine Word-Length

Instruction Type

CISC

Kernel

PIC

VGA

1*VGA 1920*1080@60Hz(1080P)

M.2 SSD

No M.2 Slot

Wi-Fi

Inside WiFi & Blue-Tooth Combo

Products Status

Stock

Max Memory Size

8GB

HD-Mi

2*HD-Mi 4096*2160@30Hz(4K)

CPU Lithography

22 Nm

Memory Types

1*DDR3l So-DIMM 204 Pin

Processor Graphics

Intel Iris Graphics 5100

USB Port

4*USB 3.0 Port, 4*USB 2.0 Port

Weight

Net 1.1kg; Gross 1.9 Kg

Transport Package

Color Box

Specification

Package size 308*206*75mm

Trademark

HYSTOU

Origin

Guangdong, China

HS Code

8471504090

Production Capacity

20000 Unit/ Month

Company profile

Shenzhen Anstou Technology LTD

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2014-12-01Nearest Port: SHENZHENAverage Response Time: ≤4.96hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, EXW, CIF, DDP, DAP, Others, CPT

AI-Powered supplier vetting

SummaryThe supplier is identified as a professional technical supplier with software development, electronic-component manufacturing, mechanical equipment R&D, and related sales and import/export activities. It provides 3D software design and multiple customization modes, including sample-, design-, full-, minor-, and flexible customization. ISO 9001 certification is reported. Innovation evidence includes one R&D engineer and new products launched during the past year, but total R&D experience is below five years and no SDK is available. Production capacity is only partially demonstrated: annual output is stated as below the provided threshold and off-peak lead time is within 15 workdays. The supplier claims exports to multiple regions and OEM/ODM cooperation, but formal service procedures, complaint-handling records, corrective-action procedures, and approved supplier lists are absent. Overseas showroom, agent/branch, and trade-show capabilities are not reported as available. No customer cases are explicitly...

Supplier typeThe supplier is explicitly described as a professional technical supplier and operates in software, computer hardware, electronic components, power-electronic components, and mechanical equipment R&D. Its stated focus covers compact computers, rugged devices, software, and related equipment, indicating a technology-oriented manufacturer and solution provider.

CertificationsISO 9001 certification is explicitly reported. This supports the existence of a certified quality-management system, although no other certifications are stated in the provided information.

R&D capabilityInnovation capability is supported by professional technical R&D status, software and mechanical-equipment R&D activities, 3D design services, design collaboration, flexible customization, and new products launched during the past year. However, the supplier has one R&D engineer, total R&D experience below five years, and no available SDK, indicating capability with limitations in R&D scale and developer-platform support.

Production capacityThe supplier reports electronic-component and power-electronic-component manufacturing, flexible handling of small or batch orders, and off-peak lead time within 15 workdays. However, the stated annual production output is below the provided threshold, so the evidence supports operational production capability but not strong scale capacity.

Customization capabilityThe supplier explicitly offers customization from samples, customization from designs, full customization, minor customization, and flexible customization. Its description also states that R&D collaborates on appearance, functionality, and software design, providing direct evidence of broad OEM/ODM and product-customization capability.