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UV Picosecond Laser Drilling & Degumming Machine for Glass Substrate Tgv IC Carrier Board
US$230,000.00
1-4 Pieces
US$190,000.00
5-9 Pieces
US$150,000.00
10+ Pieces
Sample price:US$0.00/piece.Request sample
Product profile
Customization
AvailableAfter-sales Service
12 MonthsWarranty
12 MonthsModel NO.
U30OEM&ODM
AcceptedCertificates
CE, ISO9001Processing Speed
10, 000 Holes/MinMain Application
Semiconductor Tgv, High-Frequency PCBProcessing Function
Drilling, Scribing, AblationPositioning Accuracy
±0.02mmHeat-Affected Zone
<5μmYield Rate
>98%Substrate Protection
Zero Substrate DamageAi Feature
Ai-Optimized Processing Path PlanningTransport Package
Wooden CaseSpecification
2500*2200*1900mmTrademark
INTEOrigin
ChinaProduction Capacity
100sets/MonthKey features
High-Speed Production: Up to 10,000 holes per minute using AI-optimized motion paths.
High Yield Rate: Ensures processing yield over 98% through non-contact laser technology.
Multi-Material Compatibility: Processes glass, ceramics, copper-based materials, and electronic substrates.
Comprehensive Customization: Full customization, minor customization, and design-based options available.
Global After-Sales Support: Remote technical support, spare parts supply, and 12-month warranty coverage.
Industrial Grade Stability: Solid rigid frame design for long-term stable operation and low maintenance.
Company profile
CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 4 years CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤4.12h
AI-Powered supplier vetting
SummaryThe supplier is a limited company with 182 employees and offers laser-processing equipment, including automatic laser cutting, drilling, wafer marking, glass cutting, and laser marking machines. Its R&D capability is supported by available design documentation, 3D design services, recent new-product development, ODM/OEM services, and SDK availability. The supplier provides flexible customization and has documented procedures for finished-product inspection, supplier management, corrective actions, and complaint handling. After-sales services include debugging, maintenance, repair, training, and equipment installation in the USA, Canada, and Macedonia. However, no overseas warehouses, showrooms, agents, or branches are reported. The provided information does not establish certifications, financial credibility, or identifiable customer cases.
Supplier typeThe supplier is identified as a combined company and a limited company, with 182 employees and no stated affiliation with a larger corporate group. Its product scope is centered on laser-processing equipment.
After-Sales capabilityThe supplier’s engineers support production and after-sales service, while overseas offerings include debugging, maintenance, repair, training, and equipment installation in the USA, Canada, and Macedonia. Complaint handling has a clear procedure with followed records, although the supplier reports no overseas warehouse, showroom, agent, or branch.
R&D capabilityThe supplier reports available R&D audit documentation, including design input, output, review, verification, and validation records; it also provides 3D design services, had new products during the past year, and offers ODM, OEM, and SDK capabilities. These are explicit indicators of established product-development capability.
Production capacityThe supplier offers multiple laser equipment products, has 182 employees, uses documented and uniformly followed finished-product inspection instructions, and maintains procedures for supplier qualification, service capability, corrective actions, quality assurance, complaint handling, and material traceability. The slices support structured production and quality processes, but do not provide production capacity or output figures.
Customization capabilityThe supplier explicitly provides 3D software design services and supports customization from samples, customization from designs, full customization, minor customization, and flexible customization. This directly demonstrates broad customization coverage.
Product Q&A
Q:What's the difference from traditional processing?
A:
Unlike mechanical drilling or ordinary lasers, it realizes cold processing with no chipping, no cracks, and minimal thermal damage.
Q:How fast is TGV glass drilling Machine?
A:
Up to 10,000 holes per minute, supporting efficient mass production.
Q:What materials can it process?
A:
Glass (borosilicate, fused silica), sapphire, ceramics, high-frequency PCB substrates, and other brittle materials.
Q:Will it cause chipping or thermal damage?
A:
No. It provides clean, smooth edges with zero chipping & low thermal impact, perfect for high-end electronics.
Q:Does it improve production yield?
A:
Yes. Non-contact laser processing greatly reduces scrap rates and ensures stable, consistent quality.
Send Inquiry
*To:
Shenzhen Inte Laser Technology Co., Ltd.
Shenzhen Inte Laser Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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