High-End Vacuum Reflow Oven Machine for Produce PCBA Board SMT

Name: High-End Vacuum Reflow Oven Machine for Produce PCBA Board SMT
Brand: Shenzhen Jaguar Automation Equipment Co., Ltd.
SKU: 2110498435

Guangdong, ChinaShenzhen Jaguar Automation Equipment Co., Ltd.

US$140,000.00

1-2 Pieces

US$130,000.00

3+ Pieces

Product profile

Customization

Available

After-sales Service

1 Year

Condition

New

Model NO.

VR-1200-N

Certification

CCC, ISO, CE

Warranty

12 Months

Automatic Grade

Automatic

Installation

Vertical

Warming Time

45mins

Conveyor Height

900±20 mm

Transport Speed

300-2000mm/Min

Exhaust

10m3/Min×2

Transport Package

Vacuum

Specification

7160*1670*1460mm

Trademark

Jaguar

Origin

Shenzhen

HS Code

8515190000

Production Capacity

150 Sets/Month

Key features

An in-line automated system designed for mass production. It can directly adopt standard reflow temperature profiles,

Built for demanding production environments with a weight of approximately 4250 4500 kg, a maximum PCB width of 460mm, and a top clearance of 40mm to accommodate a wide range of product sizes

Features a 5P external water chiller for rapid cooling (meeting lead-free process requirements) and an efficient flux recovery system to prevent resin residue and reduce maintenance downtime

Company profile

Experienced TeamFast DeliveryR&D CapabilitiesProduct Certification

Shenzhen Jaguar Automation Equipment Co., Ltd.

Guangdong, China

Business Type: Manufacturer/FactoryExport Year: 2015-04-02Nearest Port: ShenzhenAverage Response Time: ≤6.65hTerms of Payment: T/TInternational Commercial Terms(Incoterms): FOB, EXW

AI-Powered supplier vetting

SummaryThe supplier operates in automation, testing equipment, precision components, mechanical and electrical equipment, electronics, and related repair and leasing services. It demonstrates broad customization, ODM and brand OEM capabilities, recent product development, technical support, and an international customer-service network covering more than 3,500 users. Quality assurance is stated, and finished products are checked by packing staff. However, the supplier lacks a valid manufacturing contract with associated subcontractors, has no overseas warehouse or showroom, and has no available SDK. Financial information is limited to stated years without performance metrics, while customer cases are not specifically identified.

Supplier typeThe supplier is an equipment and technology provider covering automation, automated testing, precision components, mechanical and electrical equipment, electronics, repairs, and related services. Its ODM and brand OEM offerings indicate a manufacturer or solution provider rather than only a trading intermediary.

After-Sales capabilityThe supplier claims a professional technical-service capability, customer-first after-sales system, international marketing and customer-service coverage for over 3,500 users, and service lead times within 15 working days in both peak and off-season. It also reports inventory capability, but complaint handling and corrective/preventive action are recorded as “Others,” and there is no overseas warehouse or showroom.

R&D capabilityThe supplier reports new products within the past year, provides ODM services, supports broad design customization, and has developed four types of environmentally friendly reflow ovens. Its lack of an available SDK limits evidence of software or platform extensibility, but does not negate the documented product-development capability.

Production capacityListed production-related equipment includes laser, electrical discharge, and pipe-cutting machines, and the supplier reports in-stock capability and OEM service for popular brands. Quality assurance is stated, but finished products are checked by packing staff, and there is no valid contract with associated subcontractors, creating a documented manufacturing-control weakness.

Customization capabilityThe supplier explicitly offers customization from samples, designs, full customization, minor customization, and flexible customization across both R&D and design-service records. This is direct evidence of a broad customization range.

Product Q&A

Q:What is the mechanism behind void reduction?

When the solder is in its molten state inside the vacuum chamber, the external pressure drops to 1-10 mbar. This pressure differential forces gas bubbles inside the molten solder joint to escape, drastically reducing the final void rate

Q:What applications is this oven best suited for?

It is highly recommended for industries and products where solder joint reliability is critical, including power electronics (IGBT), automotive electronics (LED car lights), semiconductors, aerospace, and medical devices

Q:How does it compare to standard soldering?

Standard nitrogen reflow yields a void rate of 25, The VR1200N uses vacuum technology to reduce this to 3