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Customizable Chip-Embedding-Compatible Pure ABS Core SIM Card Sheet
US$2.20
100-1,999 kg
US$2.00
2,000-19,999 kg
US$1.60
20,000+ kg
Sample price:US$1.00/piece.Request sample

Product profile

Customization

Available

After-sales Service

Support

Warranty

1 Year

Model NO.

Pure ABS Core Sheet for SIM Cards

Type

SIM Card Core Sheet

Material

ABS

Application

Decoration Parts, Structural Components, Functional Components

Material Properties

Chemical Resistance

Markets Served

Industrial

Customized

Customized

Usage

Internal

Color

Single Color

Surface Finishing

Finished

Keywords

SIM Card Core Sheet

Thickness Range

0.10-0.76 mm

Surface

Matte

Supply Form

Sheet / Roll

Surface Tension #3

≥40 Dynes/Cm

Surface Tension #2

≥40 Dynes/Cm

Vicat Softening Point

100-105°C

Vicat Condition

B50

Tensile Strength MD

≥40 MPa

Tensile Strength CD

≥38 MPa

Printing Process

Offset / UV / Screen Printing

Primary Use

SIM / GSM Card Core

Key Card Use

Key Cards

Access Card Use

Access Control Cards

ID Card Use

Corporate ID / Campus Cards

Transport Package

PE Bags+Pallet.

Specification

Customized

Trademark

ZHENZHEN NEW MATERIAL

Origin

Jiangsu, China

HS Code

39203000

Production Capacity

1000 Tons/Month

Key features

Pure ABS Material: White, matte pure ABS core sheet designed for SIM/GSM and smart card manufacturing.
Multiple Printing Support: Compatible with Offset, UV, and Screen Printing processes for diverse applications.
Chip-Module Integration: Engineered for seamless lamination, punching, milling, and chip-module integration.
Comprehensive Warranty: 1-year warranty coverage with full after-sales service support for all clients.

Company profile

CertifiedBusiness Type: Manufacturer/Factory & Trading Company CertifiedR&D Capacity: ODM Service Available & OEM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 2 Years CertifiedNearest Port: Shanghai PortAverage Response Time: ≤24h

About Our Factory & Business Background

AddressSuqian, Jiangsu, China
Plant Area20780 square meters
Number of Employees59
Registered Capital15,000,000 RMB
Terms of PaymentLC, T/T, D/P, PayPal, Western Union, Small-amount payment
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Minimum Order Quantity1 T
Supply Chain Partners300

Our Production Capability & Technical Expertise

Main ProductsPC Film, PETG Film, ABS Film
Production Lines6
Production MachinesFilms Production Line, High Speed Splitter, Precision Cutting Machine, Strip Rewinding Machine
QA/QC inspectors3 people
Inspection Type for Finished Products100% inspection(Visual inspection & Function inspection)
Inspection Method for Finished ProductsHave instructions and uniformly followed
R&D Engineers2 people
Traceability of Raw MaterialsYes
Test Reports for Raw MaterialsOthers
Own BrandYes

Our Industry Experience & Global Business Record

Year of Establishment2022-03-24
Main MarketsDomestic, South Asia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff3
Overseas Agent/BranchNo
New Products Launched in Last yearYes

Our Certifications, Standards & Industry Recognition

Management System CertificationISO9001:2015
Cooperated with Fortune 500No

Product Q&A

Q:Why choose Pure ABS instead of PVC/ABS or PVC?
A:
Choose pure ABS when the card program specifically requires the thermal, mechanical or processing behavior of an ABS material platform.
Q:Can I use the Vicat value as my lamination temperature?
A:
No. Lamination depends on the full material stack, equipment, pressure, dwell and cooling cycle.
Q:Do the dyne values guarantee printing adhesion?
A:
No. Surface tension supports print-process control, but actual adhesion also depends on ink chemistry, curing, surface cleanliness and downstream processing.
Q:Which printing methods are supported?
A:
The product supports offset, UV and screen printing.
Q:Can Pure ABS be used for SIM-card module packaging?
A:
SIM/GSM cards are a primary application direction. Module cavity preparation, bonding and final fit should still be validated with the actual production system.

Send Inquiry

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