Full set of 2D & 3D geometric measurement operators, supporting distance & positional measurement of point-point, point-line, point-circle, line-line, line-circle, circle-circle.
It can measure height, step difference, contour, volume, area and other 3D parameters; inspection results and images can be automatically saved and exported locally.
Wide FOV image stitching on XY axis automatically aligns and merges multiple frames to output ultra-large HD full-view images, solving partial defocus caused by height difference of workpieces.
Zero-code graphical programming platform. Users can build complete inspection workflows by dragging operator modules without professional coding skills.
It meets the high-speed mass continuous inspection demands of large panels such as photovoltaic wafers, PCBs and silicon wafers, and greatly improving production line inspection tact time.
Integrated and compact hardware design. The measuring head, Z-axis module and controller support plug-and-play automatic recognition.
Lightweight with only 5kg weight, it can be easily integrated into existing automated equipment and production lines. The axial optical path balances both 2D imaging and 3D dimensional measurement.
Integrated and compact hardware design. The measuring head, Z-axis module and controller support plug-and-play automatic recognition. Lightweight with only 5kg weight.
A single device can realize both micro R&D analysis of new products in laboratories and mass inline sampling inspection on production lines by switching objectives and electric zoom.
Enterprises do not need to purchase multiple single-magnification microscopes, effectively cutting equipment procurement costs and space occupation.