Equipped with a fully upgraded optical imaging system, synthesis and stitching algorithms are optimized synchronously.
Four core imaging indicators are greatly improved compared with traditional microscopes, including optical resolution, color reproduction, multi-light imaging performance and pixel definition.
Micro textures, metallographic structures and tiny scratches can be clearly presented without distortion or color cast.
Ultra DOF depth synthesis function captures layered images within customizable Z-axis range and records height data, then synthesizes full-focus true-color point cloud images.
It supports 3D measurement of bonding arc height, BGA bump height, profile, volume, surface roughness and height difference, and generates pseudo-color height cloud maps.
Integrated 7 types of lighting modes: coaxial light, ring light, side light, bottom transmitted light, polarization, DIC differential interference and four-color light.
Different lights match smooth wafers, diffuse metal, transparent crystals, stress texture and micro scratches to expose hidden defects effectively.
Support 2D planar stitching and 3D depth stitching, maximum stitching pixel reaches over 10 billion.
Built-in real-time focus preview window displays the relative position between lens and sample with anti-collision warning line, simplifying side wall observation.
Complete 2D & 3D measurement functions. 3D measurement includes height difference, profile, volume, surface roughness Ra/Sa. All measurement data can be exported to tables.