Kathmatic Professional Diameter Measurement Instrument 3D Profile Tester for Chip Packaging Test

3D morphology, length/angle/radius/center distance, depth/step, contour, roughness (Ra/Rz/Sa/Sz), flatness, volume/area, defect detection, automatic report generation. Support parallel analysis of multiple devices, scanning and processing in parallel, doubling efficiency.

Metal, graphite, wafer, glass PCB, Copper pads, etched structures, battery electrodes, shot peened parts, fracture surfaces, transparent materials, porous materials, and soft materials can all be tested. Welcome to make an appointment for specific testing needs and sample testing to see the results

Ordinary microscopes can only observe; The profilometer may scratch the sample; KC-X3000 is a one-stop measurement system for non-contact, 3D morphology, size, roughness, and flatness, with nanometer level accuracy and no damage to the sample.

KC-X3000 is a three in one precision measuring microscope developed by Kathmatic, which integrates morphology scanning, ultra depth of field observation, and fusion measurement. It uses spectral confocal technology to achieve non-contact, high-precision 3D microscopy measurement.

The device integrates three core functions: morphology scanning, ultra depth of field observation, and fusion measurement. One device can replace traditional 3D profilometers, ultra depth of field microscopes, and contour measuring instruments, achieving integrated observation, scanning, and measurement operations.