3-in-1 integrated design, integrating three core functions of morphology scanning, ultra-depth synthesis & image stitching, and 3D fusion measurement in one unit.
It can replace multiple devices including optical profilometer, ultra-DOF microscope, contour measuring instrument and measuring microscope, greatly reducing equipment procurement and space cost.
Adopt laser spectral confocal scanning technology with no physical probe contact and zero pressure during measurement, avoiding scratch, deformation or contamination on samples.
Compatible with fragile materials such as silicon wafers, thin films, foamed copper and 3D printed parts to realize non-destructive testing.
Covering micrometer roughness, millimeter micro-texture and meter-level geometric tolerance samples.
New visual selection function with global navigation camera, freely switch navigation view and measurement view, one-click frame selection for large-area or tiny local scanning area.
Synchronous focus design of measuring lens and laser lens supports auto anti-collision, greatly speeding up focusing and improving overall testing efficiency by over 50%.
Generate true-color/pseudo-color 3D point cloud models, one-click export CSV, Excel, PDF reports and raw point cloud data for traceability.
All-in-one intelligent analysis software with complete 2D & 3D measurement tools, supporting batch calculation of planar dimension, contour section, height difference, volume/area, surface roughness .
Compatible with various materials including transparent glass, metal, foam, polymer, semiconductor wafer and ceramic.