Q: Can we inspect the production process?

A: Yes. Customers are welcome to visit our factory. Production photos and inspection reports can also be provided when needed.

Q: How do you control quality?

A: We use flying probe or electrical testing for PCB, and AOI, X-ray, FAI, visual inspection, and functional testing for PCBA.

Q: Can you source components for us?

A: Yes. We can provide full or partial component sourcing according to your BOM.

Q: Can you provide programming and functional testing?

A: Yes. We can provide IC programming, firmware downloading, and customized functional testing.

5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c Laminate and RO4450f with Immersion Gold

Name: 5 Layer High Frequency PCB Board Bulit on Rogers 20mil RO4003c Laminate and RO4450f with Immersion Gold
Brand: Shenzhen Kynex Electronics Technology Co., Ltd.
SKU: 2187987002

Guangdong, ChinaShenzhen Kynex Electronics Technology Co., Ltd.

US$1.44

10-499 Pieces

US$1.23

500-999 Pieces

US$1.14

1,000-4,999 Pieces

US$0.35

5,000+ Pieces

Sample price:US$2.50/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Model NO.

Custom Main PCBA

Material

Fiberglass Epoxy

Application

Communication

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Aluminum

Insulation Materials

Organic Resin

Brand

Customized

Layers

1-24 Layers

Max Panel Size

558*670 mm

Hole Wall Copper Thickness

Max 35 μm

Pth Hole Diameter Tolerance

0.05 mm

Hole Position Accuracy

Min +/- 0.05mm

Transport Package

Customized

Specification

Customized

Trademark

Customized

Origin

China

HS Code

8534009000

Production Capacity

20000000

Key features

High-Density Integration: Supports compact, multi-layer PCB layouts with fine-pitch components, delivering more functionality in a smaller footprint.

Precision SMT Assembly: Advanced automated placement ensures accurate component positioning, consistent solder joints, and dependable mass-production quality.

Reliable Signal Integrity: Optimized PCB layout and controlled routing help minimize interference, crosstalk, and signal loss in high-speed applications.

Industrial-Grade Reliability: Built for stable long-term operation under demanding environments, with strict inspection throughout the manufacturing process.

Fine-Pitch Capability: Supports compact IC packages including QFN, QFP, BGA, and other high-density components for sophisticated electronic designs.

Multi-Layer PCB Support: From simple prototypes to complex multi-layer boards, our production capability supports demanding routing and integration requirements.

Consistent Soldering Quality: Precision reflow and automated inspection help reduce solder defects and maintain reliable electrical connections.

Prototype to Mass Production: Seamlessly scale from engineering samples and small batches to stable, high-volume PCBA manufacturing.

Fast Prototype Turnaround: Accelerated PCB fabrication and assembly help shorten development cycles and bring products to market faster.

One-Stop PCBA Solution: PCB fabrication, component sourcing, SMT assembly, DIP assembly, programming, testing, and final inspection from one supplier.