Q: Can we inspect the production process?

A: Yes. Customers are welcome to visit our factory. Production photos and inspection reports can also be provided when needed.

Q: How do you control quality?

A: We use flying probe or electrical testing for PCB, and AOI, X-ray, FAI, visual inspection, and functional testing for PCBA.

Q: Can you source components for us?

A: Yes. We can provide full or partial component sourcing according to your BOM.

Q: Can you provide programming and functional testing?

A: Yes. We can provide IC programming, firmware downloading, and customized functional testing.

Turnkey Service for Fr4 Multilayer PCBA with BGA Process Customized

Name: Turnkey Service for Fr4 Multilayer PCBA with BGA Process Customized
Brand: Shenzhen Kynex Electronics Technology Co., Ltd.
SKU: 2189554602

Guangdong, ChinaShenzhen Kynex Electronics Technology Co., Ltd.

US$1.43

10-499 Pieces

US$1.25

500-999 Pieces

US$1.15

1,000-4,999 Pieces

US$0.72

5,000+ Pieces

Sample price:US$2.50/piece.Request sample

Product profile

Customization

Available

Type

Rigid Circuit Board

Dielectric

FR-4

Model NO.

Custom Main PCBA

Material

Fiberglass Epoxy

Application

Consumer Electronics

Flame Retardant Properties

Mechanical Rigid

Rigid

Processing Technology

Electrolytic Foil

Base Material

Aluminum

Insulation Materials

Organic Resin

Brand

Customized

Layers

1-24 Layers

Max Panel Size

558*670 mm

Hole Wall Copper Thickness

Max 35 μm

Pth Hole Diameter Tolerance

0.05 mm

Hole Position Accuracy

Min +/- 0.05mm

Transport Package

Customized

Specification

Customized

Trademark

Customized

Origin

China

HS Code

8534009000

Production Capacity

20000000

Key features

High-Density Integration: Supports compact, multi-layer PCB layouts with fine-pitch components, delivering more functionality in a smaller footprint.

Precision SMT Assembly: Advanced automated placement ensures accurate component positioning, consistent solder joints, and dependable mass-production quality.

Reliable Signal Integrity: Optimized PCB layout and controlled routing help minimize interference, crosstalk, and signal loss in high-speed applications.

Industrial-Grade Reliability: Built for stable long-term operation under demanding environments, with strict inspection throughout the manufacturing process.

Fine-Pitch Capability: Supports compact IC packages including QFN, QFP, BGA, and other high-density components for sophisticated electronic designs.

Multi-Layer PCB Support: From simple prototypes to complex multi-layer boards, our production capability supports demanding routing and integration requirements.

Consistent Soldering Quality: Precision reflow and automated inspection help reduce solder defects and maintain reliable electrical connections.

Prototype to Mass Production: Seamlessly scale from engineering samples and small batches to stable, high-volume PCBA manufacturing.

Fast Prototype Turnaround: Accelerated PCB fabrication and assembly help shorten development cycles and bring products to market faster.

One-Stop PCBA Solution: PCB fabrication, component sourcing, SMT assembly, DIP assembly, programming, testing, and final inspection from one supplier.