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5gcpe 5gmifi 5g Module Core Motherboard Fr-4 PCB RF PCB 10-Layer High-Density Interconnect Circuit Board Qualcomm Chip Solution
US$1.00
1-999 Piece
US$15.00
1,000+ Piece
Product profile
Type
Rigid Circuit BoardDielectric
FR-4Material
Fiberglass EpoxyModel NO.
HDI PCB 0329Application
Medical InstrumentsFlame Retardant Properties
V0Mechanical Rigid
RigidProcessing Technology
Electrolytic FoilBase Material
CopperInsulation Materials
Epoxy ResinBrand
Shengyi, Kb, Nanya, IlmSurface Finishing
Immersion Ni/AuLayer Counts
4-16L 1-4 Order Arbitrary InterconnectionCriteria
Aql II 0.65Impedance
ImpedanceBevel Edge
YesHole Sizes
0.15mm/0.2mmTransport Package
Vacuum PackagingTrademark
LIAN CHUANGOrigin
ShenzhenHS Code
8534001000Production Capacity
30000sqm/MonthCompany profile
Shenzhen Lianchuang Technology Co., LimitedGuangdong, China
Business Type: Manufacturer/Factory
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