ESD Bubble Mailing Bag for PCB Packing

Name: ESD Bubble Mailing Bag for PCB Packing
Brand: Shanghai Leenol Industrial Co., Ltd.
SKU: 739688032

Shanghai, ChinaShanghai Leenol Industrial Co., Ltd.

US$1.20

1,000-4,999 Pieces

US$0.86

5,000-9,999 Pieces

US$0.82

10,000-19,999 Pieces

US$0.69

20,000+ Pieces

Sample price:US$0.60/piece.Request sample

Product profile

Customization

Available

Certification

GS, CCC, RoHS, ISO, CE

Type

Bag, ESD

Model NO.

1507017

Usage

SMT Production Line, Printing Workshop, Computer Room, Electronic Component Maintenance Room, Combustible & Explosive Area

Surface Resistance

10e8-10e11 Ohms

Sealing & Handle

Flat Open

Color

Pink

Condition

New

Waterproof

Material

Plastic

Transport Package

Custom

Specification

custom

Trademark

LEENOL

Origin

Shangahi

Production Capacity

100000PCS/Wrrk

Company profile

High Repeat Buyers ChoiceYears of Export ExperienceExhibition ExperienceCustomization from Samples

Shanghai Leenol Industrial Co., Ltd.

Shanghai, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2011-07-01Nearest Port: Shanghai, Ningbo, QingdaoAverage Response Time: ≤7.27hTerms of Payment: LC, T/T, PayPal, etc.International Commercial Terms(Incoterms): FOB, CFR, CIF, DAP, CPT, FCA, EXW

AI-Powered supplier vetting

SummaryThe supplier is a trading company based in Shanghai, lacking in overseas service capabilities and innovation, with no recent R&D developments or new product launches. It does not collaborate with Fortune 500 companies and has limited design and customization capabilities. Financial data is available up to 2023, but there is no evidence of certifications or ERP integration for sustainable development.

Supplier typeThe supplier is identified as a trading company located in Shanghai, specifically in the wholesale and retail industry.

After-Sales capabilityThe supplier lacks written procedures or records for handling customer complaints and corrective actions, indicating a deficiency in after-sales service capability.

R&D capabilityThe supplier has not launched any new products recently, does not offer ODM or OEM services, and lacks an SDK, indicating low innovation capability.

Production capacityThe supplier has no in-stock service capacity and cannot manage overseas warehouse services, indicating limited production capabilities.

Customization capabilityCustomization is only available from samples, and the supplier does not provide 3D software design services or private mold designs.