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IC Silicon Wafer Edge Processing Machine High Accuracy
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

Automatic Processing: Semi-automatic operation where CNC system automatically grinds edges after manual loading and unloading.
Adjustable Parameters: Grinding wheel speed is 0-4500rpm adjustable, and grinding speed ranges from 1mm/S to 50mm/S.
Vacuum Chuck Fixing: Wafer is placed and fixed on a vacuum chuck for stable processing during high-speed rotation.
Wide Compatibility: Processes various wafer sizes including 3-6 inch wafers with different materials.
Strong Adhesion Force: Features an adhesion force better than -80kpa to ensure secure wafer holding.
Flexible Customization: Supports customization from samples, designs, full customization, and minor customization.
1 Year Warranty: Comes with a 1-year warranty and provided machinery test reports.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤5.53h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What wafer sizes can this machine process?
A:
It can accommodate various wafer sizes, specifically 3-6 inch wafers, and supports different materials.
Q:Is the machine fully automatic?
A:
It is semi-automatic. Manual loading and unloading are required, but the CNC system automatically performs the grinding process.
Q:What are the adjustable speed ranges?
A:
The grinding wheel speed is adjustable from 0 to 4500rpm, and the grinding speed ranges from 1mm/S to 50mm/S.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 Set.
Q:What is the lead time for delivery?
A:
The average lead time is one month for both peak season and off-season.

Send Inquiry

*To:Nanjing Likesmile New Energy Technology Co., Ltd.Nanjing Likesmile New Energy Technology Co., Ltd.
*Content:
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