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IC Silicon Wafer Edge Rounding Machine for Chip Manufacturing
US$7,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearApplication
Silicon WafersModel NO.
BWVoltage
380 VCore Components
PLCMachinery Test Report
ProvidedKey Selling Points
AutomaticVideo Outgoing-Inspection
ProvidedPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
1560X700X940mmTrademark
BWOrigin
Jiangsu, ChinaKey features
Wide Size Compatibility: Processes silicon wafers ranging from 3 to 6 inches with adjustable grinding speeds.
Automatic Operation: Semi-automatic design requires only manual loading/unloading while auto-grinding.
Adjustable Parameters: Grinding wheel speed adjustable 0-4500rpm and grinding speed 1-50mm/S.
Strong Adhesion Force: Vacuum chuck provides adhesion force better than -80kpa for secure fixing.
Flexible Customization: Supports full customization, minor customization, and customization from samples.
Compact & Efficient: Lightweight design at 350kg with 2KW power consumption for efficient production.
Quality Assurance: Machinery test reports and video outgoing inspections are provided.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤9.47h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What wafer sizes can this machine process?
A:
The machine is designed to accommodate silicon wafers ranging from 3 to 6 inches in size.
Q:Is the machine fully automatic?
A:
It features semi-automatic operation. The CNC system automatically performs grinding, but manual loading and unloading are required.
Q:Can the machine be customized?
A:
Yes, we offer full customization, minor customization, and customization from samples or designs.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What are the payment terms?
A:
The accepted payment term is LC (Letter of Credit).
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
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