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IC Wafer Edge Chamfering Equipment for Semiconductor Fab
US$7,000.00
1 Piece
Product profile
Customization
AvailableWarranty
1 YearApplication
Silicon WafersModel NO.
BWVoltage
380 VCore Components
PLCMachinery Test Report
ProvidedKey Selling Points
AutomaticVideo Outgoing-Inspection
ProvidedPower (Kw)
2Weight (Kg)
350Grinding Disc Size
4 InchesWorkpiece Size
3-6 InchesGrinding Wheel Speed
0-4500rpm AdjustableWafer Center Positioning Accuracy
≤±0.1mmGrinding Speed
1mm/S-50mm/SAdhesion Force
Better Than -80kpaMain Motor Speed
0-90rpmTransport Package
1560X700X940mmTrademark
BWOrigin
Jiangsu, ChinaKey features
Wide Size Compatibility: Accommodates various wafer sizes from 3 to 6 inches with adjustable grinding speed from 1mm/S to 50mm/S.
Automatic Operation: Semi-automatic operation requires only manual loading/unloading while the CNC system handles grinding automatically.
Adjustable Grinding Speed: Grinding wheel speed is adjustable from 0 to 4500rpm, and grinding speed ranges from 1mm/S to 50mm/S.
Strong Adhesion Force: Vacuum chuck provides adhesion force better than -80kpa to securely fix the wafer during processing.
Flexible Customization: Supports customization from samples, designs, full customization, and minor customization options.
1 Year Warranty: Comprehensive 1-year warranty coverage for the equipment to ensure reliability and support.
Compact Design: Lightweight and compact unit weighing 350kg with 2KW power, suitable for efficient production lines.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤5.83h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What wafer sizes can this equipment process?
A:
The equipment is designed to process various wafer sizes, specifically accommodating wafers ranging from 3 to 6 inches.
Q:Is the grinding speed adjustable?
A:
Yes, the grinding wheel speed is adjustable from 0 to 4500rpm, and the grinding speed can be set between 1mm/S and 50mm/S.
Q:Does the machine support customization?
A:
Yes, we offer flexible customization options including customization from samples, designs, full customization, and minor customization.
Q:What is the warranty period for this equipment?
A:
We provide a 1-year warranty for this IC Wafer Edge Chamfering Equipment.
Q:How does the equipment fix the wafer during processing?
A:
The wafer is placed and fixed on a vacuum chuck with an adhesion force better than -80kpa to ensure stability during chamfering.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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