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Likesmile Industrial Silicon Wafer Cutting Machine with Diamond Wire
US$7,000.00
1 Piece
US$6,500.00
2+ Pieces
Product profile
Customization
AvailableWarranty
1 YearVoltage
380V50HzModel NO.
BWPower(W)
2 KwCore Components
PLCMachinery Test Report
ProvidedVideo Outgoing-Inspection
ProvidedWeight (Kg)
2500Surface Roughness
Ra0.8(Um)Electrode Wire Diameter Range
0.7/2.5mmMachine Tool Guide Rail
Steel Guide Rail, Linear Guide RailZ-Axis Travel
500Maximum Load Capacity
600kgMaximum Machining Speed
160(mm/Min)Maximum Power Consumption
2kwTransport Package
700*750*1850Trademark
bwOrigin
Jiangsu, ChinaKey features
Diamond Wire Cutting Technology: Specialized equipment for cutting semiconductor single-crystal silicon wafers with high efficiency.
Versatile Wafer Compatibility: Processes silicon rods compatible with 8-inch and 12-inch wafers up to 450mm length.
High Precision Surface Finish: Achieves surface roughness of Ra0.8 Um with low silicon loss and high processing quality.
Robust Load Capacity: Maximum load capacity of 600kg with a maximum machining speed of 160mm/Min.
Comprehensive Warranty Coverage: Provides a 3-year warranty period for the machine.
Full Customization Options: Offers full customization, minor customization, and flexible customization from samples or designs.
Advanced Core Components: Equipped with PLC core components and steel/linear guide rails for stability.
Quality Inspection Reports: Includes provided machinery test reports and video outgoing-inspection services.
Company profile
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h
About Our Factory & Business Background
AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20
Our Production Capability & Technical Expertise
Main ProductsMechanical Equipment
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo
Our Certifications, Standards & Industry Recognition
Cooperated with Fortune 500No
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a comprehensive 3-year warranty period for this industrial silicon wafer cutting machine.
Q:What wafer sizes can this machine process?
A:
It is designed to process silicon rods compatible with 8-inch and 12-inch wafers, with a maximum length of 450mm.
Q:Is customization available for this equipment?
A:
Yes, we offer full customization, minor customization, and flexible customization options based on samples or designs.
Q:What is the maximum load capacity of the machine?
A:
The machine supports a maximum load capacity of 600kg with a machining speed of up to 160mm/Min.
Q:Does the machine come with quality inspection reports?
A:
Yes, we provide both machinery test reports and video outgoing-inspection services.
Send Inquiry
*To:
Nanjing Likesmile New Energy Technology Co., Ltd.
Nanjing Likesmile New Energy Technology Co., Ltd.*Content:
Supplier replies will be sent to your registered email
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