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Likesmile Silicon Wafer Edge Grinding Equipment for Semiconductor Line
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

Automatic Operation: CNC system automatically grinds wafer edges with precise trajectory control.
Wide Size Compatibility: Processes 3-6 inch wafers with adjustable grinding speed from 1mm/S to 50mm/S.
Flexible Customization: Supports full customization, minor customization, and customization from samples or designs.
Vacuum Chuck Fixation: Wafer is securely placed and fixed on a vacuum chuck for stable processing.
Adjustable Motor Speed: Main motor speed ranges from 0-90rpm with grinding wheel speed up to 4500rpm.
Comprehensive Testing: Video outgoing inspection and machinery test report are provided for quality assurance.
One Year Warranty: Equipment comes with a standard 1-year warranty coverage.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this equipment?
A:
The equipment comes with a 1-year warranty.
Q:What wafer sizes can this machine process?
A:
It accommodates wafers ranging from 3 to 6 inches.
Q:Is the machine fully automatic?
A:
It is semi-automatic; only manual loading and unloading are required, while grinding is automated.
Q:What is the minimum order quantity?
A:
The minimum order quantity is 1 set.
Q:What payment terms are accepted?
A:
We accept LC (Letter of Credit) as the payment term.

Send Inquiry

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