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Likesmile Silicon Wafer Edge Grinding Machine Supplier China
US$7,000.00
1 Piece

Product profile

Customization

Available

Warranty

1 Year

Application

Silicon Wafers

Model NO.

BW

Voltage

380 V

Core Components

PLC

Machinery Test Report

Provided

Key Selling Points

Automatic

Video Outgoing-Inspection

Provided

Power (Kw)

2

Weight (Kg)

350

Grinding Disc Size

4 Inches

Workpiece Size

3-6 Inches

Grinding Wheel Speed

0-4500rpm Adjustable

Wafer Center Positioning Accuracy

≤±0.1mm

Grinding Speed

1mm/S-50mm/S

Adhesion Force

Better Than -80kpa

Main Motor Speed

0-90rpm

Transport Package

1560X700X940mm

Trademark

BW

Origin

Jiangsu, China

Key features

High Precision Control: Precise control of chamfer angle, size, and surface roughness with adjustable cutting speed and depth.
Automatic Grinding Process: CNC system automatically grinds wafer edges according to preset trajectory and parameters.
Flexible Wafer Compatibility: Processes various wafer sizes from 3 to 6 inches and different materials.
Adjustable Grinding Speed: Grinding wheel speed adjustable from 0 to 4500rpm with grinding speed range of 1mm/S to 50mm/S.
Vacuum Chuck Fixation: Wafer is placed and fixed securely on a vacuum chuck for stable processing.
Core PLC Component: Equipped with high-quality PLC core component for reliable automated operation.
Full Customization Available: Offers full customization, minor customization, and flexible customization from samples or designs.
One Year Warranty: Comes with a standard 1-year warranty coverage for peace of mind.

Company profile

Nanjing Likesmile New Energy Technology Co., Ltd.
High Repeat Buyers ChoiceFast DeliveryMinor CustomizationR&D Capabilities
CertifiedBusiness Type: Trading Company CertifiedR&D Capacity: ODM Service Available CertifiedCustomization Options: Customization from Samples, Customization from Designs, etc. CertifiedExport Year: 1 Year CertifiedNearest Port: Shanghai PortAverage Response Time: ≤6.03h

About Our Factory & Business Background

AddressRoom 590, No. 80, Xiaoshi Street, Gulou District, Nanjing, Jiangsu, China
Plant Area30 square meters
Number of Employees4
Registered Capital1,000,000 RMB
Terms of PaymentLC
International Commercial Terms(Incoterms)FOB, CIF, CFR, EXW
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Minimum Order Quantity1 Set
Supply Chain Partners20

Our Production Capability & Technical Expertise

Main ProductsMechanical Equipment
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2023-02-27
Main MarketsAustralia
Repeat Buyers Choice50%~80%
Number of Foreign Trading Staff1
Overseas Agent/BranchNo
New Products Launched in Last yearNo

Our Certifications, Standards & Industry Recognition

Cooperated with Fortune 500No

Product Q&A

Q:What is the warranty period for this machine?
A:
The equipment comes with a 1-year warranty.
Q:Can this machine handle different wafer sizes?
A:
Yes, it can accommodate wafers ranging from 3 to 6 inches.
Q:Is the machine fully automatic?
A:
It is semi-automatic, requiring only manual loading and unloading while the grinding process is automated.
Q:What is the maximum grinding speed?
A:
The grinding speed ranges from 1mm/S to 50mm/S, and the wheel speed is adjustable up to 4500rpm.
Q:Do you offer customization services?
A:
Yes, we offer full customization, minor customization, and flexible customization based on samples or designs.

Send Inquiry

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