High Precision C19210 C19400 C18045 Copper Coil for Lead Frame

C19210, C19400 and C18045 are professional lead-frame-grade copper alloys with stable internal stress, excellent flatness and uniform thickness tolerance, perfectly suitable for high-speed stamping an

Outstanding anti-softening and thermal stability during SMT reflow soldering, no deformation or warping after plastic packaging.

Excellent solderability and plating performance, compatible with tin plating, nickel plating and gold plating for semiconductor packaging.

C19400 features balanced strength and conductivity as mainstream global lead frame material.

C19210 provides higher electrical and thermal conductivity for high heat dissipation requirements.

C18045 owns ultra-low residual stress, ideal for high-end QFN and miniature etched frames.