T3 General Pure Copper Strip Low Cost Ordinary Hardware Stamping Material

Grade three general tough pitch pure copper, copper plus silver total content no less than ninety-nine point seven percent, the most cost-effective entry-level pure copper series for mass civil manufa

Retains basic conductive and thermal transfer performance of pure copper, fully meet low-current, low-heat load general industrial component demands

Stable cold stamping and bending forming performance, suitable for simple flat stamping, gasket punching and conventional angle bending without obvious cracking risk

Smooth natural reddish copper surface, compatible with tin and nickel surface plating, uniform coating layer for indoor decorative and shielding products

Mature mass production process with full regular specifications in stock, ideal substitute for T2 copper when product does not require high precision and high conductive standards