Customization
AvailableApplication
Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and AerospaceConductive Adhesive
Conductive Silver PasteModel NO.
circuit_board_035Flame Retardant Properties
V0Processing Technology
Electrolytic FoilBase Material
CopperInsulation Materials
Organic ResinProduct Category Entity
Custom Flexible Printed Circuit BoardSupported Layer Count
1-14 Layer Single/Double-Sided & Multilayer FlexBase Dielectric Material
Polyimide (Pi) Film, Polyester (Pet)Finished Board Thickness
0.05 mm - 0.40 mm (50 μm - 400 μm)Base Copper Weight
0.33 Oz - 2.0 Oz (12 μm - 70 μm)Min Line Width / Space
0.035 mm / 0.035 mm (1.4 Mil / 1.4 Mil)Min Drilling Hole Size
0.10 mm (4 Mil) Laser Via / MicroviaMinimum Bend Radius
Sub-2.0 mmStiffener Material Options
Stainless Steel, Fr-4, Polyimide (Pi), AluminumCoverlay Film Options
Polyimide Film + Acrylic / Epoxy AdhesiveSurface Finish Options
OSP, Immersion Silver, Selective Gold PlatingFlammability Standard
UL 94V-0 Standard CompliantQuality Inspection Standard -01
100% Aoi, Flying Probe E-TestQuality Inspection Standard -02
Dynamic Flex Fatigue TestingAcceptability Standard
Ipc-6013 Class 2 & Ipc-6013 Class 3Transport Package
Wooden BoxSpecification
CustomizedTrademark
M2PCBOrigin
Shenzhen, ChinaProduction Capacity
50000 Square Meters / Month