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Automatic Wire Ball Bonder Wire Ball Bonder
US$25,000.00-30,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

MD-S800

Weight

800kg

Specification

1230mm*940mm*1660mm

Trademark

minder-hightech

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

High Precision Bonding: X-Y stage accuracy of 0.04 mil (1um) for precise wire ball bonding operations.
High Efficiency Output: Achieves 28K units per hour for single wire and 15K for dual wire bonding.
Advanced Image Recognition: 256 grey scale system recognizing R/G/B and matte chips with 640*480 resolution.
Reliable Components: Equipped with UTHE ultrasonic generator/transducer and OMRON temperature controller.
Large Program Memory: Supports storage of up to 1000 programs for versatile production needs.
Standard Warranty: Comes with a 1-year warranty covering after-sales service and mechanical parts.
Professional Quality Control: Strict pre-production sampling and final inspection before shipment guaranteed.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤15h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:What is the bonding speed and output capacity?
A:
The bonding cycle is 70ms per 2mm wire. Output is 28K units/hour for single wire and 15K for dual wire.
Q:What are the X-Y stage specifications?
A:
The X-Y stage stroke is 65*70 mm with an accuracy of 0.04 mil (1um).
Q:Does the machine support multiple languages?
A:
Yes, the Windows XP user interface supports both Chinese and English languages.
Q:What is the warranty period for this equipment?
A:
We provide a 1-year warranty for the Automatic Wire Ball Bonder MD-S800.
Q:What are the accepted payment terms and currencies?
A:
Accepted payment types include T/T, PayPal, and Cash. Currencies accepted are USD, EUR, HKD, and CNY.

Send Inquiry

*To:Guangzhou Minder-Hightech co.,LtdGuangzhou Minder-Hightech co.,Ltd
*Content:
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