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High Precision Mini Surface Flat Lapping Grinding Polishing Finishing Machine for Research
US$50,000.00-80,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

MD

Type

Stone Polishing Machine

Control

CNC

Automation

Semi-automatic

Precision

High Precision

Application

Semicon Wafer

Type for Grinding Machine

Special Grinding Machine

Grinding Machine Type

Barrel Polishing Machine

Grinding Method

Wet Grind

Certification

CE

Condition

New

Transport Package

Wooden Case

Trademark

minder-hightech

Origin

China

Production Capacity

1000

Key features

High Precision Performance: Removes 95% of surface defects for highly flat semiconductor wafer surfaces.
Compact Desktop Design: Suitable for laboratories, research rooms, and small production environments.
Low Pressure Processing: Applies slight pressure to avoid damage to samples or devices.
Adjustable Swing Arm: Amplitude adjustable from 0 to 15 degrees with uniform speed control.
Precise Liquid Control: Drip rate uniformly adjustable from 1 to 100 ml/min.
Dual Workstation Option: Compatible with two 6-inch fixtures using dual peristaltic pumps.
Full LCD Control System: Features touch screen control, program editing, and storage capabilities.
CE Certified Equipment: Meets international safety and quality standards for semiconductor processing.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.08h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:Are the prices negotiable?
A:
All prices are competitive and negotiable, varying based on configuration and customization complexity.
Q:Do you offer sample production services?
A:
Yes, we can provide sample production services, though some fees may apply.
Q:What is the payment process?
A:
After plan confirmation, a deposit is required. The balance is paid when equipment is ready, followed by shipping.
Q:How is delivery handled?
A:
After manufacturing, an acceptance video is sent, and you may also inspect the equipment at the site.
Q:Is installation and debugging support available?
A:
Yes, engineers can be dispatched to your factory for installation and debugging upon arrival of the equipment.

Send Inquiry

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