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Integrated Circuit Automatic Wire Bonding Machine Gold Wire Bonding Machine Automatic Wire Wedge Bonder
US$30,000.00-100,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

1 Year

Warranty

1 Year

Model NO.

MD-Etech1850g

Condition

New

Certification

CE

Customized

Customized

Material

Metal

After Warranty Service

Online Support

Local Service Location

United States

After-Sales Service Provided

Free Spare Parts

Specification

280kg

Trademark

minder-hightech

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

Full-Auto Ultrasonic Bonding: MD-Etech1850G model featuring full-automatic ultrasonic thin wire wedge bonding technology.
High Bonding Throughput: Achieves 14K UPH based on 2 mm wire length for efficient production.
Customized Configuration: Machine supports customized options to meet specific production requirements.
Precise Resolution: XY travel resolution of 0.02 mil ensures high-precision wire bonding.
Programmable Parameters: Bond force, power, time, and F/T resolution are fully programmable.
CE Certified Safety: Product meets CE certification standards for safety and quality assurance.
1-Year Warranty Coverage: Comprehensive 1-year warranty provided for the new condition machine.
Online After-Sales Support: Provides online support and free spare parts for after-warranty service.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.69h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:What is the bonding throughput?
A:
The bonding throughput is 14K UPH (Units Per Hour) based on a 2 mm wire length.
Q:What is the warranty period?
A:
The machine comes with a 1-year warranty coverage.
Q:Is the machine customizable?
A:
Yes, the machine supports customized configurations to meet specific needs.
Q:What is the resolution of the XY travel?
A:
The XY travel resolution is 0.02 mil, ensuring high precision.
Q:What after-sales services are provided?
A:
We provide online support and free spare parts for after-warranty service.

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