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Manual Ultrasonic Thin Wire Wedge Bonding Machine
US$999.00-8,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearTransport Package
Plywood Packing by Fast ExpressModel NO.
mdb-2575Specification
50kgTrademark
minder-hightechOrigin
GuangzhouHS Code
8515809090Production Capacity
500/YearKey features
Wide Application Scope: Suitable for COB, IC, digital tubes, lattice, integrated circuits, transistors, and semiconductor devices.
Dual Channel Control: Features two independent channels for ultrasonic power, bond time, and bond force settings.
Motorized Precision: Includes motorized control for bond span (0-10mm) and bond radius (0-6mm) with high accuracy.
Flexible Wire Compatibility: Supports wedge bonding for wire diameters ranging from 25 to 75 micrometers.
Adjustable Parameters: Ultrasonic power adjustable 0-3W, bond time 5-200ms, and bond force 10-60g.
Compact Design: Dimensions 600x560x390mm with a weight of 36kg for efficient workspace utilization.
Optional Digital Camera: Digital camera available as an optional accessory for enhanced visual monitoring.
Standard Warranty: Comes with a 1-year after-sales service warranty for peace of mind.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.27h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year after-sales service warranty.
Q:What types of components can this machine bond?
A:
It is applicable for COB, IC, digital tubes, lattice, integrated circuits, transistors, and semiconductor devices.
Q:What are the wire diameter specifications?
A:
The machine supports wedge bonding for wire diameters between 25 and 75 micrometers.
Q:Does the machine support dual channel operation?
A:
Yes, it features two channels that can be set separately for ultrasonic power, bond time, and bond force.
Q:What is the lead time for orders?
A:
The average lead time is one month, regardless of whether it is peak season or off-season.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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