Wide Application Scope: Suitable for COB, IC, digital tubes, lattice, integrated circuits, transistors, and semiconductor devices.
Dual Channel Control: Features two independent channels for ultrasonic power, bond time, and bond force settings.
Motorized Precision: Includes motorized control for bond span (0-10mm) and bond radius (0-6mm) with high accuracy.
Flexible Wire Compatibility: Supports wedge bonding for wire diameters ranging from 25 to 75 micrometers.
Adjustable Parameters: Ultrasonic power adjustable 0-3W, bond time 5-200ms, and bond force 10-60g.
Compact Design: Dimensions 600x560x390mm with a weight of 36kg for efficient workspace utilization.
Optional Digital Camera: Digital camera available as an optional accessory for enhanced visual monitoring.
Standard Warranty: Comes with a 1-year after-sales service warranty for peace of mind.