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MD-Etech1850g Full-Auto Ultrasonic Thin Wire Wedge Bonder Bonding Machine
US$25,000.00-30,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
MD-Etech1850gWeight
280kgTransport Package
Wooden Box PackagingSpecification
760x820x1450mmTrademark
minder-hightechOrigin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
High Bonding Speed: Achieves up to 8 wires/second for 2mm wire with strong T-motor table movement.
Thin Wire Capability: Specifically designed for thin AL wire ranging from 15-50um thickness.
High Throughput: Delivers UPH of 14K based on 2mm wire length for efficient production.
Advanced Control System: Includes I5 computer, new camera, Z system, and WIN7 OS compatible software.
Programmable Precision: Bond force, power, time, and F/T resolution are fully programmable.
Large Program Storage: Stores up to 99 programs with 1000 chips and 1000 wires per program.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤6.27h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for this machine?
A:
The machine comes with a 1-year warranty and 1-year after-sales service.
Q:What is the maximum bonding speed?
A:
It can bond up to 8 wires per second for 2mm wire, with a throughput of 14K UPH.
Q:What types of wires can this bonder handle?
A:
It is applicable for thin AL wire from 15-50um, with a wire size range of 0.7 mil to 2.0 mil.
Q:How many programs can the machine store?
A:
It has a program storage capacity of 99 programs, with 1000 chips and 1000 wires per program.
Q:What is the lead time for delivery?
A:
The average lead time is one month for both peak season and off-season.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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