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Semiconductor Device Fab Crystal Semiconductor Square Bar Rounding Forming Grinding Machine Magnetic Equipment
US$2,300.00-6,500.00
1 Set
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearModel NO.
123Type
Stone Polishing MachineControl
ArtificialAutomation
Semi-automaticPrecision
PrecisionCertification
CEMaximum Processing Size (mm)
Φ3square Blank, Φ6 Cylindrical BlankMinimum Processing Size (mm)
Φ0.8Grinding Length Range (mm)
10-50Grinding Speed (Min)
Continuous Feeding 600-800mmGrinding Accuracy (mm)
Rough Grinding Non-Roundness ±0.04Guide Wheel Table Lateral Stroke (mm)
80up and Down Stroke of Guide Plate (mm)
25Main Motor
1.5kw ×1460r/MinSecondary Motor
1.1kw × (0-1200r/Min)Weight
400kgTransport Package
Standard Export Wooden Case PackingSpecification
890 *850 *1300mmTrademark
MinderOrigin
ChinaProduction Capacity
100 Pieces/ MonthKey features
High Efficiency Grinding: Grinds small square bars into cylinders in one pass with large grinding amount and high efficiency.
Fine Material Capability: Minimum processing diameter reaches 0.8mm, ideal for fine materials like crystals and semiconductors.
Versatile Material Application: Suitable for magnetic materials, optical glass, ceramics, silicon wafers, and gemstones.
Dual Operation Models: Available in semi-automatic and fully automatic models to suit different production needs.
CE Certified Equipment: Machine meets CE safety and quality certification standards for international markets.
Flexible Motor Control: Secondary motor features electronic adjustment with speed range 0-1200r/min.
Compact Industrial Design: Dimensions 890x800x1200mm with 400kg weight for stable operation.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.51h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for this machine?
A:
We provide a 1-year warranty covering mechanical defects.
Q:What is the minimum processing diameter?
A:
The machine can process materials with a minimum diameter of 0.8mm.
Q:What types of materials can be processed?
A:
It handles hard brittle materials including NdFeB, SmCo, ferrite, optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, and gemstones.
Q:Is the machine fully automatic?
A:
We offer both semi-automatic and fully automatic models; one worker can operate multiple fully automatic units simultaneously.
Q:What is the maximum processing size?
A:
The maximum processing size is a 3mm square blank or a 6mm cylindrical blank.
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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