What is the difference between LP and LX models?

LP models polish without a grinding disc reviser, while LX models can perform grinding and include a grinding disc reviser for integrated processing.

How is the grinding disc temperature managed?

The machine is equipped with a grinding fluid circulation system that can control the temperature between 1 degree.

What are the available disc sizes?

Available disc sizes range from D380mm to D1600mm, depending on the specific model selected.

Semiconductor Device Fabrication Fab Wafer Fab Feol Beol Single Side Polisher Mdfd-610lp-3q Mdfd-910lp-3q

Name: Semiconductor Device Fabrication Fab Wafer Fab Feol Beol Single Side Polisher Mdfd-610lp-3q Mdfd-910lp-3q
Brand: Guangzhou Minder-Hightech co.,Ltd
SKU: 1989860605

Guangdong, ChinaGuangzhou Minder-Hightech co.,Ltd

US$15,000.00-50,000.00

1 Piece

Product profile

Customization

Available

Specification

1600*2100*2200

Trademark

minder-hightech

Model NO.

MDFD-610LP-3Q MDFD-910LP-3Q

Origin

Guangzhou

HS Code

8015809090

Production Capacity

200PCS/Yearpcs/Year

Key features

High Precision Polishing: Achieves roughness Ra0.0002 and flatness 0.002 for high-precision products.

Triple Station Efficiency: Features 3 working stations to grind and polish 3 workpieces simultaneously.

Advanced PLC Control: Uses PLC and touch screen for direct setting of grinding speed and time.

Temperature Control: Equipped with grinding fluid circulation system to control temperature within 1 degree.

Safety Mechanism: Cylinder prevents dropping when air is out, avoiding potential injuries.

Versatile Material Support: Suitable for high hardness, thin materials like sapphire, silicon wafer, and ceramics.

Disc Reviser Option: LX models include grinding disc reviser for integrated grinding and polishing.

Wide Model Range: Available in multiple models from D380 to D1600 disc sizes to fit various needs.

Company profile

Guangzhou Minder-Hightech co.,Ltd

Guangdong, China

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤11.64h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

AI-Powered supplier vetting

SummaryGuangzhou Minder-Hightech Co., Ltd, established in 2014 in Guangdong, China, operates as a trading company with a focus on industrial equipment and components. Despite being a limited company with only 10 employees, it has maintained a strong relationship with high-profile companies like Bosch and Apollo, suggesting robust industry connections. The company exports a significant portion of its products to Europe and North America, which constitutes 41-50% of its total sales. However, it lacks formal certification in supplier management systems and has limited R&D resources. With an annual production output of approximately US$1-2.5 million, it operates eight production lines but does not hold certifications, which could be a limitation in quality assurance.

Supplier typeGuangzhou Minder-Hightech Co., Ltd is classified as a trading company and operates as a limited company.

CertificationsThe company does not hold any certifications for supplier management systems.

R&D capabilityDespite being a relatively new company, it claims over 20 years of experience in welding technology and maintains relationships with high school scientific research institutions.

Production capacityThe company operates eight production lines with a total manufacturing area of 260.0m² and an annual production output between US$1-2.5 million.

Client casesThe company has collaborated with prominent firms such as Bosch and Apollo, indicating established customer cases.

Product Q&A

Q:What is the maximum polishing precision achievable?

The machine can achieve a roughness of Ra0.0002 and a flatness of 0.002.

Q:How many workpieces can be processed at once?

The machine features 3 working stations, allowing it to grind and polish 3 workpieces simultaneously.

Q:What types of materials can this polisher handle?

It is suitable for high hardness, thin, and high precision products, including sapphire substrate, ceramic, optical glass, quartz crystal, silicon wafer, and aluminum alloy.

Q:How is the machine controlled?

The machine uses a PLC and touch screen control system, allowing direct setting of grinding speed and time.

Q:What safety features are included?

The cylinder will not drop down when air is out, which helps avoid injuries during operation.