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Semiconductor Device Fabrication Fab Wafer Fabrication Etching Inductively Coupled Plasma Etching Machine Icp for Si/Sio2/Sinx/ Sic Beol Feol
US$100,000.00-150,000.00
1 Piece

Product profile

Customization

Available

After-sales Service

Installation, Training

Warranty

One Year Warranty

Model NO.

MD150-SICP

Type

Electrical Etching Machine

Object

Silicon-Based:Si/Sio2/Sinxsic

Usage

Corrosion & Hollowed-out

Certification

ISO9001: 2000, CE

Etching Type

Reactive Ion Etching

Precision

High Precision

Condition

New

Transport Package

Wooden Case

Specification

1170*750*1080mm

Trademark

Minder-Hightech

Origin

China

Production Capacity

10set/Month

Key features

High Precision Etching: Decouples plasma ion density and energy for improved control accuracy and flexibility.
Wide Material Compatibility: Supports Si, SiO2, SiNx, SiC, III-V, II-VI, metals, and organic materials.
Customizable Configuration: Offers adjustable power, custom wafer sizes up to 12 inches, and tailored gas channels.
Excellent Process Stability: Ensures high repeatability suitable for fine etching and compound semiconductors.
Comprehensive After-Sales: Includes installation, training, debugging, and online technical support.
One Year Warranty: Covers mechanical defects with cost-price replacement for parts after warranty.
Flexible Power Options: Adjustable RF power from 0-5000W with automatic matching capabilities.
Multi-Channel Gas Control: Supports up to 12 gas channels with precise flow control for diverse processes.

Company profile

Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤9.51h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW

About Our Factory & Business Background

AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month

Our Production Capability & Technical Expertise

Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people

Our Industry Experience & Global Business Record

Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo

Product Q&A

Q:What is the warranty period?
A:
Our equipment has a 12-month warranty period. After the warranty period, if any parts are damaged and need to be replaced, we will only charge the cost price.
Q:What materials can this machine etch?
A:
It supports silicon-based materials (Si, SiO2, SiNx, SiC), III-V materials (InP, GaAs, GaN), II-VI materials, magnetic/metals, organic materials, and dielectric materials.
Q:Can the machine be customized?
A:
Yes, we offer customization for wafer size (up to 12 inches), power source, molecular pump capacity, gas channels, and temperature control ranges.
Q:What is the payment term?
A:
After the plan is confirmed, you need to pay a deposit first. After the equipment is ready, you pay the balance, and then we ship it.
Q:Do you provide installation services?
A:
Yes, we can dispatch engineers to install and debug the equipment at your factory. A separate quotation is provided for this service fee.

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