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Semiconductor Device Fabrication Wafer Fab Beol Feol Precision Blade Dicing Cutting Saw for Wafer Cutting
US$47,000.00-63,000.00
1 Piece
Product profile
Customization
AvailableAfter-sales Service
1 YearWarranty
1 YearTransport Package
Wooden CrateSpecification
665mm*850mm*1650mmTrademark
minder-hightechOrigin
GuangzhouHS Code
8015809090Production Capacity
200PCS/Yearpcs/YearKey features
High Precision Cutting: Full positioning accuracy <=0.005mm/210mm with 0.0005mm stroke resolution.
Customizable Groove Depth: Groove depth <=4mm or customized to meet specific wafer requirements.
Advanced Control System: Equipped with DS-300 software and 15-inch LCD touch screen for easy operation.
Versatile Material Support: Cuts silicon wafers, sapphire, glass, ceramics, and PCB boards.
Multi-Chip Cutting: Supports alignment and cutting of multiple processed objects simultaneously.
Stable Performance: High reliability with low maintenance cost and stable spindle rotation.
1-Year Warranty: Comprehensive 1-year warranty and after-sales service included.
Company profile
Business Type: Manufacturer/Factory, Trading CompanyExport Year: 2014-12-31 CertifiedNearest Port: Shenzhen PortAverage Response Time: ≤7.89h CertifiedTerms of Payment: T/T CertifiedInternational Commercial Terms(Incoterms): EXW
About Our Factory & Business Background
AddressRoom 813, No. 43, Xinshuikeng Section, Shixin Road, Dalong Street, Panyu District, Guangzhou, Guangdong, China
Registered Capital1,000,000 RMB
Average Lead TimePeak Season Lead Time: one month Off Season Lead Time: one month
Our Production Capability & Technical Expertise
Main ProductsWire Bonder, Soldering Machine, Bond Tester, Grinder and Polisher, Dicing Saw, Die Bonder, Plasma Surface Treatment Machine, Ultrasonic Metal Welder, Glue Dispenser, Parallel Sealing Welder
R&D Engineers1 people
Our Industry Experience & Global Business Record
Year of Establishment2014-12-30
Main MarketsNorth America, Europe
Overseas Agent/BranchNo
Product Q&A
Q:What is the warranty period for this dicing machine?
A:
We provide a 1-year warranty and after-sales service for the equipment.
Q:Is the groove depth customizable?
A:
Yes, the groove depth is <=4mm or can be customized according to your needs.
Q:What materials can be cut with this precision dicing machine?
A:
It is suitable for blue glass, silicon wafers, gallium arsenide, lithium niobate, alumina, ceramics, quartz, sapphire, crystal, and PCB boards.
Q:What is the positioning accuracy of the machine?
A:
The full positioning accuracy is <=0.005mm/210mm, with a single-step positioning accuracy of <=0.003mm/5mm.
Q:What are the payment terms for this product?
A:
The terms of payment are T/T (Telegraphic Transfer).
Send Inquiry
*To:Guangzhou Minder-Hightech co.,Ltd
Guangzhou Minder-Hightech co.,Ltd*Content:
Supplier replies will be sent to your registered email
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